Direct wire-bonding of silicon devices without metal pads

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2009, Pages 757-760

  Hirshberg, A ^a   Elata, D ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

EXPERIMENTAL MEASUREMENTS; HIGH-TEMPERATURE PROCESSING; METAL BONDS; METAL PAD; SILICON DEVICES; WIRE BONDS; WIREBONDING;

ELECTRON DEVICES; ELECTRONICS PACKAGING; METALS; WIRE;

BONDING;

EID: 66049145376     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2009.4805493     Document Type: Conference Paper

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