Modeling, design, and characterization of multiturn bondwire inductors with ferrite epoxy glob cores for power supply system-on-chip or system-in-package applications

IEEE Transactions on Power Electronics

Volumn 25, Issue 8, 2010, Pages 2010-2017

  Lu, Jian ^a   Jia, Hongwei ^a   Wang, Xuexin ^a   Padmanabhan, Karthik ^a   Hurley, William Gerard ^b   Shen, Zheng John ^a  

^a University of Central Florida   (United States)

^b NATIONAL UNIVERSITY OF IRELAND   (Ireland)

Author keywords

Ferrite; on chip magnetics; power supply system on chip (PsoC); power supply system on package (PSiP); wirebond

Indexed keywords

BOND-WIRE INDUCTORS; BONDWIRE; COST-EFFECTIVE APPROACH; COUPLING EFFECT; EMPIRICAL CALCULATION METHODS; HIGH EFFICIENCY; HIGH-CURRENT; IC PACKAGING; MAGNETIC COMPONENTS; MULTI-TURN; MUTUAL INDUCTANCE; ON CHIPS; POWER SUPPLY SYSTEM; Q-FACTORS; SYSTEM IN PACKAGE; SYSTEM-IN-PACKAGE APPLICATIONS; WIREBOND;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CHIP SCALE PACKAGES; COST EFFECTIVENESS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRIC POWER SYSTEMS; FERRITE; INDUCTANCE; MICROPROCESSOR CHIPS; PACKAGING; PROGRAMMABLE LOGIC CONTROLLERS;

ELECTRIC INDUCTORS;

EID: 77954153180     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2010.2045514     Document Type: Article

References (24)

1. Market and Technology Report on Power Supply in a Package and Power Supply on a Chip, Power Sources Manufacturers Association, Mendham, NJ, Technol. Rep., 2008.
2. S. C. O. Mathuna, T. O'Donnell, N. Wang, and K. Rinne, "Magnetics on silicon: An enabling technology for power supply on chip," IEEE Trans. Power Electron., vol.20, no.3, pp. 585-592, May 2005.
3. M.Wang, K. Ngo, I. Batarseh, and H. Xie, "Design and fabrication of integrated power inductor based on silicon molding technology," presented at the 38th Annu. IEEE Power Electron. Spec. Conf. (PESC 2007), Orlando, FL, Jun.
4. T. Sato, K. Yamasawa, H. Tomita, T. Inoue, and T. Mizoguchi, "Planar power inductor using FeCoBN magnetic film with high saturation magnetization and high electrical resistivity," in Proc. 4th International Power Electronics Conference (IPEC 2000), Tokyo, Japan, Apr., pp. 303-308.
5. C. H. Ahn and M. G. Allen, "Micromachined planar inductors on silicon wafers for MEMS applications," IEEE Trans. Ind. Electron., vol.45, no.6, pp. 866-876, Dec. 1998.
6. Y. Fukuda, T. Inoue, T. Mizoguchi, S. Yatabe, and Y. Tachi, "Planar inductor with ferrite layers for DC-DC converter," IEEE Trans. Magn., vol.39, no.4, pp. 2057-2061, Jul. 2003.
7. E. J. Brandon, E. Wesseling, V. White, C. Ramsey, L. Del Castillo, and U. Lieneweg, "Fabrication and characterization of microinductors for distributed power converters," IEEE Trans. Magn., vol.39, no.4, pp. 2049-2056, Jul. 2003.
8. J. Y. Park, S. H. Han, and M. G. Allen, "Batch-fabricated microinductors with electroplated magnetically anisotropic and laminated alloy cores," IEEE Trans. Magn., vol.35, no.5, pp. 4291-4300, Sep. 1999.
9. Y. Katayama, S. Sugahara, H. Nakazawa, and M. Edo, "High powerdensity MHz-switching monolithic DC-DC converter with thin-film inductor," in Proc. 31st Annu. IEEE Power Electron. Spec. Conf. (PESC 2000), Galway, Ireland, vol.3, Jun., pp. 1485-1490.
10. K. H. Kim, J. Kim, H. J. Kim, S. H. Han, and H. J. Kim, "A megahertz switching DC/DC converter using FeBN thin film inductor," IEEE Trans. Magn., vol.38, no.5, pp. 3162-3164, Sep. 2002.
11. Z. J. Shen, "A method of manufacturing low cost on-chip magnetic components," U.S. Provisional Patent Serial No. 11/835,144, Aug. 7, 2007.
12. Z. J. Shen, J. Lu, X. Cheng, H. Jia, and X. Gong, "On-chip bondwire inductor with ferrite-epoxy coating: a cost-effective approach to realize power systems on chip," in Proc. 38th Annu. IEEE Power Electron. Spec. Conf. (PESC 2007), Orlando, FL, Jun., pp. 1599-1604.
13. J. Lu, H. Jia, A. Arias, X. Gong, and Z. J. Shen, "On-chip bondwire transformers for powerSOCapplications," in Proc. 23rd Annu. IEEE Appl. Power Electron. Conf. Expo. (APEC 2008), Austin, TX, Feb., pp. 199-204.
14. J. Lu, H. Jia, A. Arias, X. Gong, and Z. J. Shen, "On-chip bondwire magnetics with ferrite-epoxy glob coating for power systems on chip," Int. J. Power Manage. Electron., vol.2008, 2008 Article ID 678415, 9 pp.
15. J. Craninckx and M. S. J. Steyaert, "A 1.8-GHz CMOS low phase-noise voltage-controlled oscillator with prescaler," IEEE J. Solid-State Circuits, vol.30, no.12, pp. 1474-1482, Dec. 1995.
16. K. S. Yeo, H. P. Ian, J. Ma, M. A. Do, and J. K. W. Chew, "High performance RF inductors and transformers using bonding technique," U.S. Patent 6 998 953, Feb. 2006.
17. D.-B. Cheon, "Inductor including bonding wires," U.S. Patent 6 194 774, Feb. 2001.
18. R. B. Merrill and I. Singh, "Bonding wire inductor for use in an integrated circuit package and method," U.S. Patent 5 886 393, Mar. 1999.
19. M. A. Imam and S. Yoganathan, "Inductor formed at least partially in a substrate," U.S. Patent 5 767 563, Jun. 1998.
20. E. J. Brandon, E. E. Wesseling, V. Chang, and W. B. Kuhn, "Printed microinductors on flexible substrates for power applications," IEEE Trans. Compon. Packag. Technol., vol.26, no.3, pp. 517-523, Sep. 2003.
21. P. M. Raj, P. Muthana, T. D. Xiao et al., "Magnetic nanocomposites for organic compatible miniaturized antennas and inductors," in Proc. 10th Int. Symp. Adv. Packag. Mater., Process., Properties Interfaces, Irvine, CA, Mar. 2005, pp. 272-275.
22. Ansoft Corporation. (2007). [Online]. Available: http://www.ansoft.com
23. W. G. Hurley and S. J. Croall, "Electromagnetic voltage induction and mitigation on passive conductors from overhead transmission lines," IEEE Trans. Power App. Syst., vol.PAS-102, no.7, pp. 2341-2348, Jul. 1983.
24. H. M. Greenhouse, "Design of planar rectangular microelectronic inductor," IEEE Trans. Parts, Hybrids, Package, vol.PHP-10, no.2, pp. 101-109, Jun. 1974.