Flexible chip-scale package and interconnect for implantable MEMS movable microelectrodes for the brain

Journal of Microelectromechanical Systems

Volumn 18, Issue 2, 2009, Pages 396-404

  Jackson, Nathan ^a   Muthuswamy, Jit ^a  

^a Arizona State University   (United States)

Author keywords

Bio microelectromechanical systems (MEMS); Biomedical microdevices; Brain implants; Microflex technology; Neural prostheses; Polyimide

Indexed keywords

BIO-MICROELECTROMECHANICAL SYSTEMS (MEMS); BIOMEDICAL MICRODEVICES; BRAIN IMPLANTS; MICROFLEX TECHNOLOGY; NEURAL PROSTHESES;

ALUMINA; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRIC CONNECTORS; ELECTROSTATIC ACTUATORS; MECHATRONICS; MEMS; MICROELECTRODES; POLYIMIDES; POLYMERS; PORTABLE EQUIPMENT; PROSTHETICS; RESISTORS; STATISTICAL TESTS; SURFACE DEFECTS; SURFACE TREATMENT; TECHNOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 67349098839     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2013391     Document Type: Article

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