Thermosonic wire bonding process simulation and bond pad over active stress analysis

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 1, 2008, Pages 61-71

  Liu, Yong ^a   Irving, Scott ^a   Luk, Timwah ^a  

^a FAIRCHILD SEMICONDUCTOR   (United States)

Author keywords

Bond pad over active design (BPOA); Stress analysis; Thermosonic wire bonding; Transient dynamics

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RESIDUAL STRESSES; SEMICONDUCTING SILICON; STRAIN RATE; STRESS ANALYSIS; SUBSTRATES; WIRE;

ACTIVE STRESS ANALYSIS; BOND PAD OVER ACTIVE DESIGN (BPOA); THERMOSONIC WIRE BONDING; TRANSIENT DYNAMICS;

BONDING;

EID: 39449101774     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.914232     Document Type: Article

References (10)

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