A fully MEMS-compatible process for 3D high aspect ratio micro coils obtained with an automatic wire bonder

Journal of Micromechanics and Microengineering

Volumn 20, Issue 1, 2010, Pages

  Kratt, K ^a   Badilita, V ^a   Burger, T ^a   Korvink, J G ^a   Wallrabe, U ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

MANUFACTURE; SILICON WAFERS; SOLENOIDS; WINDING; WIRE;

BATCH FABRICATION; COMPATIBLE PROCESS; HIGH ASPECT RATIO; HIGH THROUGHPUT; MANUFACTURING PRECISION; MANUFACTURING TIME; MECHANICAL STABILIZATION; QUALITY FACTORS;

ASPECT RATIO;

EID: 79953802102     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/1/015021     Document Type: Article

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