Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

Microelectronics Reliability

Volumn 48, Issue 3, 2008, Pages 416-424

  Hang, C J ^a,b   Wang, C Q ^a   Mayer, M ^b   Tian, Y H ^a   Zhou, Y ^b   Wang, H H ^c  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b UNIVERSITY OF WATERLOO   (Canada)

^c Nantong Fujistu Microelectronics Co Ltd   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; COPPER COMPOUNDS; CRACKS; GOLD COMPOUNDS; OPTICAL MICROSCOPY; THERMAL AGING; THIN FILM CIRCUITS;

BOND RELIABILITY; COPPER WIRES; CROSS SECTION; GROWTH BEHAVIOR;

INTERMETALLICS;

EID: 39449124367     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.06.008     Document Type: Article

References (28)

1. Harman G. Wire bonding in microelectronics, materials, processes, reliability, and yield. second ed. (1997), McGraw-Hill p. 21
2. Nguyen L.T., McDonald D., Danker A.R., et al. Optimization of copper wire bonding on Al-Cu metallization. IEEE Trans Comp Pack Manuf Technol 18 2 (1995) 423
3. Murali S., Srikanth N., and Vath III C.J. Grains, deformation substructures, and slips bands observed in thermosonic copper ball bonding. Mater Charact 50 (2003) 39
4. Tan C.W., Daud A.R., and Yarmo M.A. Corrosion study at Cu-Al interface in microelectronics packaging. Appl Surf Sci 191 (2002) 67
5. Murali S., Srikanth N., and Vath III C.J. An analysis of intermetallics formation of gold and copper ball bonding on thermal aging. Mater Res Bull 38 2 (2003) 637
6. Wulff FW, Breach CD, Stephan D, et al. Characterisation of intermetallic growth in copper and gold ball bonds on aluminum metallisation. In: Proceedings of the sixth EPTC; 2004.
7. Wulff FW, Breach CD, Stephan D, et al. Further characterization of intermetallic growth in copper and gold ball bonds on aluminum metallization. In: Proceedings of SEMICON; 2005.
8. Harman G. Wire bonding in microelectronics (1989), McGraw-Hill, New York p. 135
9. Ellis TW, Levine L, Wicen R, et al. Copper wire bonding. In: Proceedings of SEMICON conference; 2000.
10. Kim H.J., Lee J.Y., Paik K.W., et al. Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability. Trans Comp Pack Technol 26 2 (2003) 367
11. Funamizu Y., and Watanabe K. Interdiffusion in the Al-Cu system. Trans Jpn Inst Metal 12 (1971) 147
12. Braunovic M., and Alexandrov N. Intermetallic compounds at aluminum to copper electrical interfaces: effect of temperature and electric current. IEEE Trans Comp Pack Manuf Technol A17 (1994) 78
13. Tamou Y., Li J., Russell S.W., et al. Thermal and ion beam induced thin film reactions in Cu-Al bilayers. Nucl Instrum Method Phys Res B64 (1992) 130
14. 4Al. Microelectron Reliab 44 (2004) 973
15. Rajan K., and Wallach E.R. A transmission electron microscopy study of intermetallic formation in aluminum-copper thin film couples. J Crystal Growth 49 (1980) 297
16. Hentzell H.T.G., Thompson R.D., and Tu K.N. Interdiffusion in copper-aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation. J Appl Phys 54 (1983) 6923
17. Jin O., Masahiro K., and Isao A. Investigation of the reliability of copper ball bond to aluminum electrodes. IEEE Trans Comp Hybr Manuf Technol 4 (1987) 550
18. 4Al interface during ageing in air at 175 °C. Microelectron Reliab 46 (2006) 543
19. Jang G.Y., Duh J.G., Takahashi H., et al. Solid-state reaction in an Au wire connection with an Al-Cu pad during aging. J Electron Mater 35 2 (2006) 323
20. Philofsky E. Intermetallic formation in gold-aluminum systems. Solid State Electron 13 (1970) 1391
21. Lum I., Jung J.P., and Zhou Y. Bonding mechanism in ultrasonic gold ball bonds on copper substrate. Metall Mater Trans A A36 (2005) 1279
22. Takahashi Y., and Matsusaka S. Adhesional bonding of fine gold wires to metal substrates. Adhes Sci Technol 17 3 (2003) 435
23. Chen J., Degryse D., ratchev P., et al. Mechanical issues of Cu-to-Cu wire bonding. IEEE Trans Comp Pack Technol 27 3 (2004) 539
24. Schmalzried H. Chemical kinetics of solids (1995), VCH Publishers
25. Carr CLJ. Accelerated testing of gold-aluminum ball bond. MSD dissertation, University of Waterloo, Canada; 2005.
26. 4Al compound in gold ball bonds during isothermal aging in air at 175 °C. J Mater Sci 31 19 (2004) 6125
27. Philibert J. Reactive diffusion in thin films. Appl Surf Sci 53 (1991) 74
28. Beke D.L., Szabó I.A., Erdélyi Z., et al. Diffusion induced stresses and their relaxation. Mater Sci Eng A 387-389 (2004) 4