Electrical interconnection through optimized wirebonding onto SU-8 structures and actuators

Journal of Micromechanics and Microengineering

Volumn 18, Issue 7, 2008, Pages

  Sameoto, D ^a   Lee, S W ^a   Parameswaran, M ^a  

^a SIMON FRASER UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; CHEMICAL ACTIVATION; COMPOSITE MICROMECHANICS; ELECTRIC CONNECTORS; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; PHOTORESISTS; QUALITY ASSURANCE; RELIABILITY;

BALL BONDING; BOND STRENGTHS; ELECTRICAL CONNECTIONS; ELECTRICAL INTERCONNECTIONS; METAL ADHESION; METAL DEPOSITIONS; MICRO-ROUGHENING; POLYMER MEMS; POTENTIAL APPLICATIONS; PROCESSING CONDITIONS; SURFACE ACTIVATION; WIRE BONDING (WB);

FAILURE ANALYSIS;

EID: 47249106032     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/7/075023     Document Type: Article

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