A 6-Gb/s wireless inter-chip data link using 43-GHz transceivers and bond-wire antennas

IEEE Journal of Solid-State Circuits

Volumn 44, Issue 10, 2009, Pages 2711-2721

  Chen, Wu Hsin ^a   Joo, Sanghoon ^a   Sayilir, Serkan ^a   Willmot, Russell ^a   Choi, Tae Young ^a   Kim, Dowon ^a   Lu, Julia ^a   Peroulis, Dimitrios ^a   Jung, Byunghoo ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Bond wire antenna; High speed link; On chip antenna; Wirebond antenna; Wireless inter chip link; Wireless transceiver

Indexed keywords

BOND-WIRE ANTENNA; HIGH-SPEED LINK; ON-CHIP ANTENNA; WIREBOND ANTENNA; WIRELESS INTER-CHIP LINK; WIRELESS TRANSCEIVER;

ACOUSTIC INTENSITY; AUDIO FREQUENCY AMPLIFIERS; BICMOS TECHNOLOGY; BIT ERROR RATE; DETECTOR CIRCUITS; DIFFERENTIAL AMPLIFIERS; ENERGY EFFICIENCY; FADING CHANNELS; HETEROGENEOUS NETWORKS; JITTER; LOW NOISE AMPLIFIERS; POWER AMPLIFIERS; SEMICONDUCTING SILICON; SIGNAL TO NOISE RATIO; TRANSCEIVERS; TRANSMITTERS; VOLTAGE REGULATORS; WIRE; WIRELESS NETWORKS;

ANTENNAS;

EID: 71049121515     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2009.2027932     Document Type: Article

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