Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Cauchois, Romain ^a,b   Saadaoui, Mohamed ^b   Legeleux, Jacques ^b   Malia, Thierry ^a   Dubois Bonvalot, Béatrice ^a   Inal, Karim ^b   Fidalgo, Jean Chnstophe ^a  

^a GEMALTO   (France)

^b ECOLE DES MINES DE SAINT ETIENNE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION STRENGTHS; BONDING PROCESS; EFFECTIVE CONTACT; ELECTRICAL CONTACT RESISTANCE; ELECTRICAL RESISTIVITY; ELECTROLESS NICKEL PLATING; ELECTRONIC PACKAGING; FAST SINTERING; GOLD WIRE; KAPTON POLYIMIDE; LOW HARDNESS; METAL DEPOSITION; NANO SCALE; NANO-POROUS; NICKEL LAYERS; SILVER NANOPARTICLES; TEMPERATURE RAMP; WIREBONDING;

BONDING; CHIP SCALE PACKAGES; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; GOLD DEPOSITS; HARDNESS; NANOPARTICLES; NICKEL; NICKEL PLATING; POLYIMIDES; SILVER; WIRE;

SINTERING;

EID: 78651329504     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642997     Document Type: Conference Paper

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