Design in triangle-profiles and T-profiles of a wirebond using a linkage-spring model

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 3, 2001, Pages 457-467

  Lo, Y L ^a   Chen, T C ^a   Ho, T L ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Heat affect zone (HAZ); Loop height; Loop trajectory; Wire recrystallization; Wirebond profile

Indexed keywords

BONDING; FINITE ELEMENT METHOD; HEAT AFFECTED ZONE; STATISTICAL METHODS; STRESS ANALYSIS; TEMPERATURE DISTRIBUTION;

LOOP HEIGHT; LOOP TRAJECTORY; WIREBOND;

ELECTRIC WIRE;

EID: 0035441294     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.946494     Document Type: Article

References (17)

1. Crossing the 200 wire barrier in VLSI bonding
2. Fine pitch wire bonding development using a new multipurpose, multi-pad pitch test die
3. Wire bond loop profile development for fine pitch-long wire assembly
4. Finite element simulation of wire looping during wirebond fabrication
5. Linkage-spring model in analyzing wirebond loops
6. Factors governing the loop profile in Au bonding wire
7. Ball formation from a bended tip wire
8. Melting and solidification of thin wires: A class of phase-change problems with a mobile interface-I. Analysis
9. Gold wire weakening in the first thermosonic bonding of the first bond
10. Wirebond profiles characterized by a modified linkage-spring model including a looping speed factor
11. Wirebond deformation during molding of IC packages
12. Metallurgical behavior of gold wire in thermal compression bonding
13. Heat transfer in wire bonding process
14. Wire bonding strategies to meet thin packaging requirement-Part I
15. Method of wire bonding