Bonding wire loop antenna built into standard BGA package for 60 GHz short-range wireless communication

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2011, Pages

  Tsutsumi, Yukako ^a   Ito, Takayoshi ^a   Obayashi, Shuichi ^a   Shoki, Hiroki ^a   Morooka, Tasuku ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

60 GHz; antenna in package; BGA package; bonding wire; millimeter wave; short range wireless communication

Indexed keywords

60 GHZ; ANTENNA IN PACKAGE; BGA PACKAGE; BONDING WIRES; SHORT-RANGE WIRELESS COMMUNICATIONS;

FREQUENCY BANDS; PLATE METAL; WIRE; WIRELESS TELECOMMUNICATION SYSTEMS;

ANTENNAS;

EID: 80052316135     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2011.5972652     Document Type: Conference Paper

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