Progress in MEMS and micro systems research

Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Volumn , Issue , 2005, Pages 104-113

  Liu, Chang ^a  

^a Micro and Nanotechnology Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MEMS APPLICATIONS; MEMS TECHNOLOGY; SENSORS AND ACTUATORS; STATE OF THE ART;

EXHIBITIONS; MICROSYSTEMS;

CERAMIC MATERIALS;

EID: 84877752317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (88)

1. R. R. Schaller, "Moore's law: past, present, and future, " in IEEE Spectrum, vol. 34, 1997, pp. 52-59.
2. M. Riordan, "The Lost History Of the Transistor, " Spectrum, IEEE, vol. 41, pp. 44-49, 2004.
3. L. Rowen, G. Mahairas, and L. Hood, "Sequencing the Human Genome, " Science, vol. 278, pp. 605-607, 1997.
4. E. Pennisi, "BIOTECHNOLOGY: The Ultimate Gene Gizmo: Humanity on a Chip, " Science, vol. 302, pp. 211, 2003.
5. L. Peltonen and V. A. McKusick, "GENOMICS AND MEDICINE: Dissecting Human Disease in the Postgenomic Era, " Science, vol. 291, pp. 1224-1229, 2001.
6. K. E. Bean, "Anisotropic etching of silicon, " IEEE Transaction on Electron Devices, vol. ED 25, pp. 1185-1193, 1978.
7. C. S. Smith, "Piezoresistance effect in germanium and silicon, " Physics Review, vol. 94, pp. 42-49, 1954.
8. P. J. French and A. G. R. Evans, "Polycrystalline silicon strain sensors, " Sensors and Actuators A, vol. 8, pp. 219-225, 1985.
9. F. T. Geyling and J. J. Forst, "Semiconductor strain transducers, " The Bell Sysem Technical Journal, vol. 39, pp. 705-731, 1960.
10. K. E. Petersen, "Silicon As A Mechanical Material, " Proceedings of the IEEE, vol. 70, pp. 420-457, 1982.
11. K. J. Gabriel, "Microelectromechanical systems, " Proceedings of the IEEE, vol. 86, pp. 1534-1535, 1998.
12. J. B. Angell, S. C. Terry, and P. W. Barth, "Silicon Micromechanical Devices, " Scientific American Journal, vol. 248, pp. 44-55, 1983.
13. H. C. Nathanson, W. E. Newell, R. A. Wickstrom, and J. R. D. Jr., "The Resonant Gate Transistor, " IEEE Transactions on Electron Devices, vol. ED-14, pp. 117-133, 1967.
14. A. V. Chavan and K. D. Wise, "Batch- processed vacuum-sealed capacitive pressure sensors, " Microelectromechanical Systems, Journal of vol. 10, pp. 580-588, 2001.
15. A. Choujaa, N. Tirole, C. Bonjour, G. Martin, D. Hauden, P. Blind, A. Cachard, and C. Pommier, "AIN/silicon Lamb-wave microsensors for pressure and gravimetric measurements, " Sensors and Actuators A: Physical, vol. 46, pp. 179-182, 1995.
16. S. Sugiyama, M. Takigawa, and I. Igarashi, "Integrated piezoresistive pressure sensor with both voltage and frequency output, " Sensors and Actuators A, vol. 4, pp. 113- 120, 1983.
17. M. A. Fonseca, J. M. English, M. von Arx, and M. G. Allen, "Wireless micromachined ceramic pressure sensor for high- temperature applications, " Microelectromechanical Systems, Journal of, vol 11, pp. 337-343, 2002.
18. N. A. Hall and F. L. Degertekin, "Integrated optical interferometric detection method for micromachined capacitive acoustic transducers, " Applied Physics Letters, vol. 80, pp. 3859-3861, 2002.
19. S. Chatzandroulis, D. Tsoukalas, and P. A. Neukomm, "A miniature pressure system with a capacitive sensor and a passive telemetry link for use in implantable applications, " Microelectromechanical Systems, Journal of, vol. 9, pp. 18-23, 2000.
20. J.-S. Park and Y. B. Gianchandani, "A servo-controlled capacitive pressure sensor using a capped-cylinder structure microfabricated by a three-mask process, " Microelectromechanical Systems, Journal of, vol. 12, pp. 209-220, 2003.
21. C. C. Wang, B. P. Gogoi, D. J. Monk, and C. H. Mastrangelo, "Contamination- insensitive differential capacitive pressure sensors, " Microelectromechanical Systems, Journal of, vol. 9, pp. 538-543, 2000.
22. A. Gotz, I. Gracia, C. Cane, A. Morrissey, and J. Alderman, "Manufacturing and packaging of sensors for their integration in a vertical MCM microsystem for biomedical applications, " Microelectromechanical Systems, Journal of vol. 10, pp. 569-579, 2001.
23. D. R. Wur, J. L. Davidson, W. P. Kang, and D. L. Kinser, "Polycrystalline diamond pressure sensor, " Microelectromechanical Systems, Journal of, vol. 4, pp. 34-41, 1995.
24. X. Zhu, D. M. Aslam, Y. Tang, B. H. Stark, and K. Najafi, "The Fabrication of All- Diamond Packaging Panels With Built-in Interconnects for Wireless Integrated Microsystems, " Microelectromechanical Systems, Journal of, vol. 13, pp. 396-405, 2004.
25. C. A. Boeller, T. J. Carlin, P. M. Roeller, m and S. W. Steinfield, "High-volume microassembly of color thermal inkjet printheads and cartridges, " Hewlett-Package Journal, vol. 39, pp. 6-15, 1988.
26. K. E. Petersen, "Fabriaction of an integratd planar silicon ink-jet structure, " IEEE Transaction on Electron Devices, vol. ED-26, pp. 191801920, 1979.
27. J.-D. Lee, J.-B. Yoon, J.-K. Kim, H.-J. Chung, C.-S. Lee, H.-D. Lee, H.-J. Lee, C.- K. Kim, and C.-H. Han, "A thermal inkjet printhead with a monolithically fabricated nozzle plate and self-aligned ink feed hole, " Microelectromechanical Systems, Journal of, vol 8, pp. 229-236, 1999.
28. F.-G. Tseng, C.-J. Kim, and C.-M. Ho, "A high-resolution high-frequency monolithic top-shooting microinjector free of satellite drops - part I: concept, design, and model, " Microelectromechanical Systems, Journal of, vol. 11, pp. 427-436, 2002.
29. J. C. Carter, A. Welirum, M. C. Dowling, M. Cacheiro-Martinez, and N. B. Baynes, "Recent developments in materials and processes for ink jet printing high resolution polymer OLED displays, " Proceedings of the SPIE - The International Society for Optical Engineering; Organic Light- Emitting Materials and Devices VI, 8-10 July 2002, vol. 4800, pp. 34-46, 2003.
30. H. Sirringhaus, T. Kawase, R. H. Friend, T. Shimoda, M. Inbasekaran, W. Wu, and E. P. Woo, "High-Resolution Inkjet Printing of All-Polymer Transistor Circuits, " Science, vol. 290, pp. 2123-2126, 2000.
31. T. R. Hughes, M. Mao, A. R. Jones, J. Burchard, M. J. Marton, K. W. Shannon, S. M. Lefkowitz, M. Ziman, J. M. Schelter, M. R. Meyer, S. Kobayashi, C. Davis, H. Dai, Y. D. He, S. B. Stephaniants, G. Cavet, W. L. Walker, A. West, E. Coffey, D. D. Shoemaker, R. Stoughton, A. P. Blanchard, S. H. Friend, and P. S. Linsley, "Expression profiling using microarrays fabricated by an ink-jet oligonucleotide synthesizer, " Nature Biotechnology, vol. 19, pp. 342-347, 2001.
32. L.-S. Fan, Y.-C. Tai, and R. S. Muller, "IC-Processed Electrostatic Micro-motors, " presented at IEEE International Electronic Devices Meeting, 1988.
33. C. H. Ahn, Y. J. Kim, and M. G. Allen, "A planar variable reluctance magnetic micromotor with fully integrated stator and coils." Microelectromechanical Systems, Journal of, vol. 2, pp. 165-173, 1993.
34. C. Liveimore, A. R. Forte, T. Lyszczarz, S. D. Uinans, A. A. Ayon, and J. H. Lang. "A High-Power MEMS Electric Induction Motor, " Microelectromechanical Systems, Journal of. vol. 13. pp. 465-471. 2004.
35. D. S. Eddy and D. R. Sparks. "Application of MEMS technology in automotive sensors and actuators." Proceedings of the IEEE. vol. 86. pp. 1747-1755. 1998.
36. N. Yazdi, K. Najafi, and A. S. Salian. "A high-sensitivity silicon accelerometer with a folded-electrode structure." Microelectromechanical Systems, Journal of vol. 12. pp. 479-486. 2003.
37. N. Yazdi and K. Najafi. "An all-silicon single-wafer micro-g accelerometer with a combined surface and bulk micromachining process." Microelectromechanical Systems, Journal of. vol. 9. pp. 544-550. 2000.
38. A. Partridge, J. K. Reynolds, B. W. Chui, E. M. Chow, A. M. Fitzgerald, L. Zhang, N. I. Maluf, and T. W. Kenny. "A high- performance planar piezoresistive accelerometer." Microelectromechanical Systems, Journal of vol. 9. pp. 58-66. 2000.
39. D. L. DeVoe and A. P. Pisano. "Surface micromachined piezoelectric accelerometers (PiXLs), " Microelectromechanical Systems, Journal of. vol. 10. pp. 180-186.2001.
40. N. C. Loh, M. A. Schmidt, and S. R. Manalis, "Sub-10 cm3 interferometric accelerometer with nano-g resolution, " Microelectromechanical Systems, Journal of. vol. 11. pp. 182-187, 2002.
41. U. A. Dauderstadt, P. H. S. De Vries, R. Hiratsuka, and P. M. Sarro, "Silicon accelerometer based on thermopiles, "Sensors and Actuators A: Physical, vol. 46, pp. 201-204. 1995.
42. A. M. Leung, Y. Zhao, and T. M. Cunneen, "Accelerometer uses convection heating changes, " Elecktronik Praxis, vol. 8. 2001.
43. S. Butefisch, A. Schoft, and S. Buttgenbach. "Three-axes monolithic silicon low-g accelerometer." Microelectromechanical Systems, Journal of vol. 9. pp. 551-556. 2000.
44. J. Bernstein, R. Miller, W. Kelley, and P. Ward, "Low-noise MEMS vibration sensor for geophysical applications, " Microelectromechanical Systems, Journal of vol. 8. pp. 433-438, 1999.
45. C.-H. Liu and T. W. Kenny, "A high- precision, wide-bandwidth micromachined tunneling accelerometer, " Microelectromechanical Systems, Journal of. vol. 10. pp. 425-433, 2001.
46. B. Ziaie, J. A. Von Arx, M. R. Dokmeci, and K. Najafi, "A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and acftiators, " Microelectromechanical Systems, Journal of vol 5, pp. 166-179. 1996.
47. S. Lee. S. Park, J. Kim. S. Lee. and D.-I. Clio. "Surface/bulk micromachined single-ciystalline-silicon micro-gyroscope, " Microelectromechanical Systems, Journal of vol. 9, pp. 557-567. 2000.
48. J. M. Younse, "Minors on a chip." Spectrum, IEEE. vol. 30. pp. 27-31. 1993.
49. P. F. Van Kessel. L. J. Hombeck, R. E. Meier, and M. R. Douglass, "A MEMS-based projection display." Proceedings of the IEEE. vol. 86. pp. 1687-1704. 1998.
50. N. Savage, "A revolutionary chipmaking technique?, " in IEEE Spectrum, vol. 40, 2003. pp. 18.
51. S. Singh-Gasson, R. D. Green, Y. Yue, C. Nelson, F. Blattner, M. R. Sussman, and F. Cerrina, "Maskless fabricaiton of light-directed oligonucleotide microarrays using a digital micromirror array." Nature biotechnology, vol. 17. pp. 974-978. 1999.
52. "Elastomeric Organic Transistors, " Science. vol. 303, pp. 1577e-. 2004.
53. M. Mehregany, C. A. Zonnan. N. Rajan, and C. H. Wu. "Silicon carbide MEMS for harsh environments." Proceedings of the IEEE. vol. 86. pp. 1594-1609. 1998.
54. S. Tanaka, S. Sugimoto, J.-F. Li, R. Watanabe, and M. Esashi, "Silicon carbide micro-reaction-sintering using micromachined silicon molds." Microelectromechanical Systems, Journal of vol 10. pp. 55-61.2001.
55. C. R. Stoldt. C. Carraro. W. R. Ashurst. D. Gao. R. T. Howe, and R. Maboudian. "A low-temperature CYD process for silicon carbide MEMS." Sensors and Actuators A: Physical, vol. 97-98. pp. 410-415. 2002.
56. T. Shibata, Y. Kitamoto, K. Uimo. and E. Makino. "Micromachining of diamond film for MEMS applications, " Microelectromechanical Systems, Journal of vol 9. pp. 47-51. 2000.
57. Z. L. Zhang and N. C. MacDonald. "Fabrication of subniicron high-aspect-ratio GaAs actuators, " Microelectromechanical Systems, Journal of. vol. 2. pp. 66-73. 1993.
58. S. Adachi and K. Oe. "Chemical etching characteristics of (001) GaAs." Journal of Electrochemical Society, vol. 123. pp. 2427- 2435. 1983.
59. N. Chong, T. A. S. Srinivas, and H. Ahmed. "Performance of GaAs inicrobridge thermocouple infrared detectors." Microelectromechanical Systems, Journal of vol. 6. pp. 136-141. 1997.
60. N. Iwata, T. Wakayama, and S. Yamada, "Establislmient of basic process to fabricate full GaAs cantilever for scanning probe microscope applications." Sensors and Actuators A: Physical, vol. 111, pp. 26-31. 2004.
61. M. Heschel, M. Mullenbom, and S. Bouwstra, "Fabrication and characterization of truly 3-D diffuser/nozzle microstmcnires in silicon." Microelectromechanical Systems, Journal of vol. 6. pp. 41-47. 1997.
62. S. Maiuo, K. Ikuta, and H. Korogi. "Force-controllable. optically driven micromachines fabricated by single-step two-photon microstereolithography, " Microelectromechanical Systems, Journal of vol. 12. pp. 533-539. 2003.
63. J. D. Madden and I. W. Hunter. "Three- dimensional micro fabrication by localized electrochemical deposition." Microelectromechanical Systems, Journal 0f vol. 5. pp. 24-32. 1996.
64. C.-C. Tsao and E. Sachs. "Plioto-electrofomiing: 3-D geometiy and materials flexibility in a MEMS fabrication process." Microelectromechanical Systems, Journal of. vol. 8. pp. 161-171. 1999.
65. C. R. Friedrich and M. J. Vasile. "Development of the micromilling process for high-aspect-ratio microstructures, " Microelectromechanical Systems, Journal of vol. 5. pp. 33-38. 1996.
66. M. P. Vogler, R. E. DeVor, and S. G. Kapoor, "Microstiucmre-level force prediction model for micro-milling of multi- phase materials." ASME Journal of Manufacturing Science and Engineering. vol. 125. pp. 202-209. 2003.
67. A. A. Tseng. "Recent developments in micromilling using focused ion beam technology." Journal ofMicromechanics and Microengineering. vol. 14. pp. R15- R34. 2004.
68. A. D. Feinemian, R. E. Lajos, V. White, and D. D. Denton, "X-ray lathe: An X-ray lithographic exposure tool for nonplanar objects." Microelectromechanical Systems, Journal of. vol. 5. pp. 250-255. 1996.
69. M. Manohara. E. Morikawa. J. Choi, and P. T. Sprunger. "Transfer by direct photo etching of poly(vinylidene flouride) using X-rays." Microelectromechanical Systems, Journal of vol. 8. pp. 417-422. 1999.
70. D. Reynaerts, W. Meeusen, X. Song, H. V. Biussel, S. Reyntjens, D. D. Biuyker, and R. Puers, "Integrating electro-discharge machining and photolithography: work in progress, " Journal of Micromechanics and Microengineering. vol. 10. pp. 189-195, 2000.
71. K. Takahata and Y. B. Gianchandani, "Batch mode micro-electro- discharge machining, " Microelectromechanical Systems, Journal of. vol. 11. pp. 102-110, 2002.
72. S. B. Fuller, E. J. Wilhehn, and J. M. Jacobson. "Ink-jet printed nanoparticle microelectromechanical systems, " Microelectromechanical Systems, Journal of vol 11. pp. 54-60.2002.
73. J. A. Rogers, R. J. Jackinan, and G. M. Wliitesides, "Constiucting single- and multiple-helical microcoils and characterizing their performance as components of microinductors and microelectroma gnets." Microelectromechanical Systems, Journal of. vol. 6. pp. 184-192. 1997.
74. A. J. Black, P. F. Nealey, J. H. Thywissen, M. Deshpande, N. El-Zein, G. N. Maracas, M. Prentiss, and G. M. Wliitesides, "Microfabrication of two layer stracmres of electrically isolated wires using self- assembly to guide the deposition of insulating organic polymer." Sensors and Actuators A: Physical, vol. 86. pp. 96-102. 2000.
75. C. G. Wilson and Y. B. Gianchandani, "Silicon micromachining using in sim DC microplasmas." Microelectromechanical Systems, Journal of. vol. 10. pp. 50-54. 2001.
76. R.-H. Chen and C.-L. Lan, "Fabrication of high-aspect-ratio ceramic microstructares by injection molding with the altered lost mold technique." Microelectromechanical Systems, Journal of. vol. 10. pp. 62-68. 2001.
77. X.-J. Shen, L.-W. Pan, and L. Lin, "Microplastic embossing process:experimental and theoretical characterizations* 1." Sensors and Actuators A: Physical, vol. 97-98. pp. 428-433. 2002.
78. V. Walter, P. Delobelle, P. L. Moal, E. Joseph, and M. Collet, "A piezo-mechanical characterization of PZT thick films screen-printed on alumina substrate." Sensors and Actuators A: Physical, vol. 96. pp. 157-166. 2002.
79. R. J. Jackinan, S. T. Brittain, and G. M. Wliitesides, "Fabrication of three-dimensional microstnictures by electrochemically welding structures formed by microcontact printing on planar and curved substrates, " Microelectromechanical Systems, Journal of vol. 7. pp. 261-266.1998.
80. D. H. Gracias, J. Tien, T. L. Breen, C. Hsu, and G. M. Wliitesides, "Forming Electrical Networks in Three Dimensions by Self-Assembly." Science, vol. 289. pp. 1170-1172.2000.
81. G. M. Wliitesides and B. Grzybowski, "Self- Assembly at All Scales." Science, vol. 295. pp. 2418-2421.2002.
82. M. Despont, J. Biugger, U. Drechsler, U. Durig, W. Haberle, M. Lutwyche, H. Rothuizen, R. Stutz, R. Widmer, and G. Bimiig, "VLSI-NEMS chip for parallel AFM data storage." Sensors and Actuators A: Physical vol 80. pp. 100-107. 2000.
83. S. Y. Chou, P. R. Krauss. and P. J. Renstrom. "Imprint of sub-25 nmvias and trenches in polymers." Applied Physics Letters, vol. 67. pp. 3114-3116, 1995.
84. Y. Zhang, K. Salaita, J.-H. Lim, and C. A. Mirkin, "Electrochemical Whittling of Organic Nanostrucmres." Nano Letters, vol. 2, pp. 1389-1392, 2002.
85. A. J. Haes and R. P. V. Duyne, "A Nanoscale Optical Biosensor: Sensitivity and Selectivity of an Approach Based on the Localized Surface Plasmon Resonance Spectroscopy of Triangular Silver Nanoparticles." Journal of American Chemical Society, vol. 124. pp. 10596-10604.2002.
86. A. Shah, P. Tones, R. Tschamer, N. Wyrsch, and H. Keppner, "Photovoltaic Technology: The Case for Thin-Film Solar Cells." Science, vol. 285. pp. 692-698. 1999.
87. R. F. Service, "ELECTRONICS: Organic Device Bids to Make Memory Cheaper, " Science, vol. 293. pp. 1746a-. 2001.
88. C. Kim, P. E. Buitows, and S. R. Foirest. "Micropatteming of Organic Electronic Devices by Cold-Welding, " Science, vol. 288. pp.831-833, 2000.".