Manufacturing and packaging of sensors for their integration in a vertical MCM microsystem for biomedical applications

Journal of Microelectromechanical Systems

Volumn 10, Issue 4, 2001, Pages 569-579

  Götz, Andreas ^a   Gràcia, Isabel ^a   Cané, Carles ^a   Morrissey, Anthony ^b   Alderman, John ^b  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^b UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Ion sensitive field effect transistor (ISFET); Microsystem; Monolithic integration; Pressure sensor; Sensor packaging; Vertical multichip module (MCM V)

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FIELD EFFECT TRANSISTORS; MEDICAL APPLICATIONS; MICROMACHINING; MULTICHIP MODULES; SENSOR DATA FUSION; SIGNAL PROCESSING;

VERTICAL MULTICHIP MODULES;

MICROSENSORS;

EID: 0035586829     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.967380     Document Type: Article

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