메뉴 건너뛰기




Volumn 8, Issue 2, 1999, Pages 161-171

Photo-electroforming: 3-D geometry and materials flexibility in a MEMS fabrication process

Author keywords

[No Author keywords available]

Indexed keywords

CARBIDES; ELECTROLESS PLATING; ETCHING; HEAT CONDUCTION; LASER APPLICATIONS; LAYERED MANUFACTURING; MASS TRANSFER; MICROELECTROMECHANICAL DEVICES; THERMAL EFFECTS;

EID: 0033149623     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.767112     Document Type: Article
Times cited : (15)

References (28)
  • 1
    • 0032139387 scopus 로고    scopus 로고
    • Bulk micromachining of silicon
    • Aug.
    • G. T. A. Kovacs, N. I. Maluf, and K. E. Peterson, "Bulk micromachining of silicon," Proc. IEEE, vol. 86, p. 1536, Aug. 1998.
    • (1998) Proc. IEEE , vol.86 , pp. 1536
    • Kovacs, G.T.A.1    Maluf, N.I.2    Peterson, K.E.3
  • 2
    • 0032138470 scopus 로고    scopus 로고
    • Surface micromachining for microelectromechanical systems
    • Aug.
    • J. M. Bustillo, R. T. Howe, and R. S. Muller, "Surface micromachining for microelectromechanical systems," Proc. IEEE, vol. 86, p. 1552, Aug. 1998.
    • (1998) Proc. IEEE , vol.86 , pp. 1552
    • Bustillo, J.M.1    Howe, R.T.2    Muller, R.S.3
  • 3
    • 0032163268 scopus 로고    scopus 로고
    • Improved surface-micromachined hinges for fold-out structures
    • Sept.
    • A. Friedberg and R. S. Muller, "Improved surface-micromachined hinges for fold-out structures," IEEE J. Microelectromech. Syst., vol. 7, p. 315, Sept. 1998.
    • (1998) IEEE J. Microelectromech. Syst. , vol.7 , pp. 315
    • Friedberg, A.1    Muller, R.S.2
  • 4
    • 0032136370 scopus 로고    scopus 로고
    • Wafer-to-wafer bonding for microstructure formation
    • Aug.
    • M. A. Schmidt, "Wafer-to-wafer bonding for microstructure formation," Proc. IEEE, vol. 86, p. 1575, Aug. 1998.
    • (1998) Proc. IEEE , vol.86 , pp. 1575
    • Schmidt, M.A.1
  • 6
    • 0032141048 scopus 로고    scopus 로고
    • High-aspect-ratio micromachining via deep X-ray lithography
    • Aug.
    • H. Guckel, "High-aspect-ratio micromachining via deep X-ray lithography," Proc. IEEE, vol. 86, p. 1586, Aug. 1998.
    • (1998) Proc. IEEE , vol.86 , pp. 1586
    • Guckel, H.1
  • 7
    • 0027099346 scopus 로고
    • High aspect ratio electroplated microstructures using a photosensitive polyimide process
    • Travemunde, Germany, Feb. 4-7
    • A. B. Frazier and M. G. Allen, "High aspect ratio electroplated microstructures using a photosensitive polyimide process," in Micro Electro Mechanical Systems'92, Travemunde, Germany, Feb. 4-7, 1992, pp. 87-92.
    • (1992) Micro Electro Mechanical Systems'92 , pp. 87-92
    • Frazier, A.B.1    Allen, M.G.2
  • 8
    • 0344926126 scopus 로고
    • Laser deposition and etching of three-dimensional microstructures
    • CH2817-5/91/0000-0507, reprint
    • T. M. Bloomstein and D. J. Ehrlich, "Laser deposition and etching of three-dimensional microstructures," IEEE, CH2817-5/91/0000-0507, 1991, reprint.
    • (1991) IEEE
    • Bloomstein, T.M.1    Ehrlich, D.J.2
  • 10
    • 0002664314 scopus 로고
    • Solid freeform fabrication finds new applications
    • Sept.
    • H. L. Marcus and D. L. Bourell, "Solid freeform fabrication finds new applications," in Advanced Materials and Processes, Sept. 1993, pp. 28-31; 34-35.
    • (1993) Advanced Materials and Processes , pp. 28-31
    • Marcus, H.L.1    Bourell, D.L.2
  • 13
    • 0344495094 scopus 로고    scopus 로고
    • Production of injection molding tooling with conformal cooling channels using the three dimensional printing process
    • to be published
    • E. Sachs, S. Allen, M. Cima, E. Wylonis, and H. Guo, "Production of injection molding tooling with conformal cooling channels using the three dimensional printing process," Polym. Eng. Sci., to be published.
    • Polym. Eng. Sci.
    • Sachs, E.1    Allen, S.2    Cima, M.3    Wylonis, E.4    Guo, H.5
  • 14
    • 0032138772 scopus 로고    scopus 로고
    • Fabrication of 3D microstructures using micro stereolithography (1st report) - A proposal of a new type micro stereolithography and simulation of curing shape of resins
    • Y. Ohtsubo, M. Yamamoto, S. Tadokoro, and T. Takamon, "Fabrication of 3D microstructures using micro stereolithography (1st report) - A proposal of a new type micro stereolithography and simulation of curing shape of resins," J. Jpn. Soc. Precision Eng., vol. 64, no. 8, p. 1181, 1998.
    • (1998) J. Jpn. Soc. Precision Eng. , vol.64 , Issue.8 , pp. 1181
    • Ohtsubo, Y.1    Yamamoto, M.2    Tadokoro, S.3    Takamon, T.4
  • 15
    • 0029323763 scopus 로고
    • A piezoelectric-driven stereolithography-fabricated micropump
    • June
    • M. C. Carrozza, N. Croce, B. Magnani, and P. Dario, "A piezoelectric-driven stereolithography-fabricated micropump," J. Micromech. Microeng., vol. 5, no. 2, pp. 177-179, June 1995.
    • (1995) J. Micromech. Microeng. , vol.5 , Issue.2 , pp. 177-179
    • Carrozza, M.C.1    Croce, N.2    Magnani, B.3    Dario, P.4
  • 16
    • 0345357527 scopus 로고
    • Plating on nonconductors
    • F. A. Lowenheim, Ed. New York: Wiley
    • E. B. Saubestre, "Plating on nonconductors," in Modern Electroplating, F. A. Lowenheim, Ed. New York: Wiley, 1974.
    • (1974) Modern Electroplating
    • Saubestre, E.B.1
  • 17
    • 0024701778 scopus 로고
    • Selective area deposition of metal thin films on ceramic substrates by laser-induced plating
    • July
    • N. Morita, T. Watanabe, and Y. Yoshida, "Selective area deposition of metal thin films on ceramic substrates by laser-induced plating," Trans. Jpn. Soc. Mech. Eng., vol. 55, no. 515, pt. C, pp. 1790-1795, July 1989.
    • (1989) Trans. Jpn. Soc. Mech. Eng. , vol.55 , Issue.515 PART C , pp. 1790-1795
    • Morita, N.1    Watanabe, T.2    Yoshida, Y.3
  • 18
    • 0019683880 scopus 로고
    • Investigation of laser enhanced electroplating mechanisms
    • J. Cl. Puipe, R. E. Acosta, and R. J. Gutfeld, "Investigation of laser enhanced electroplating mechanisms," J. Electrochem. Soc., vol. 128, no. 12, pp. 2539-2545, 1981.
    • (1981) J. Electrochem. Soc. , vol.128 , Issue.12 , pp. 2539-2545
    • Puipe, J.C.1    Acosta, R.E.2    Gutfeld, R.J.3
  • 20
    • 0000643582 scopus 로고
    • An outline of the chemistry involved in the process of catalytic nickel deposition from aqueous solution
    • Oct.
    • G. Gutzeit, "An outline of the chemistry involved in the process of catalytic nickel deposition from aqueous solution," Plating, pp. 1158-1164, Oct. 1959.
    • (1959) Plating , pp. 1158-1164
    • Gutzeit, G.1
  • 21
    • 0344495090 scopus 로고
    • The chemical reduction of nickel-phosphorous alloys from pyrophosphate solutions
    • Los Angeles, CA, July 24-28
    • M. Schwartz, "The chemical reduction of nickel-phosphorous alloys from pyrophosphate solutions," in Tech. Proc. 47th Ann. Conv., American Electorplaters' Society, Los Angeles, CA, July 24-28, 1960, pp. 176-183.
    • (1960) Tech. Proc. 47th Ann. Conv., American Electorplaters' Society , pp. 176-183
    • Schwartz, M.1
  • 25
    • 0014857537 scopus 로고
    • Untersuchung des stofftransports an gasentwickelnden elektronden
    • V. N. Ibl and J. Venczel, "Untersuchung des stofftransports an gasentwickelnden elektronden," Metalloberflache, vol. 24, p. 365, 1970.
    • (1970) Metalloberflache , vol.24 , pp. 365
    • Ibl, V.N.1    Venczel, J.2
  • 26
    • 5944245875 scopus 로고
    • The effect of electrolytically evolved gas bubbles on the thickness of the diffusion layer - Part II
    • L. J. J. Janssen and J. G. Hoogland, "The effect of electrolytically evolved gas bubbles on the thickness of the diffusion layer - Part II," Electrochim. Acta, vol. 18, pp. 543-550, 1973.
    • (1973) Electrochim. Acta , vol.18 , pp. 543-550
    • Janssen, L.J.J.1    Hoogland, J.G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.