A servo-controlled capacitive pressure sensor using a capped-cylinder structure microfabricated by a three-mask process

Journal of Microelectromechanical Systems

Volumn 12, Issue 2, 2003, Pages 209-220

  Park, Jae Sung ^a,b   Gianchandani, Yogesh B ^a,c  

^a University of Wisconsin Madison   (United States)

^b SHRINERS HOSPITALS FOR CHILDREN   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Dissolved wafer process; Liquid encapsulation; Pressure sensor; Servo controller

Indexed keywords

DIELECTRIC LIQUIDS; ELECTRODES; MICROMACHINING; RESIDUAL STRESSES; SILICON;

SERVO-CONTROLLERS;

SENSORS;

EID: 0037387785     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2003.809953     Document Type: Article

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