High aspect ratio and low capacitance through-silicon-vias (TSVs) with polymer insulation layers

Microelectronic Engineering

Volumn 104, Issue , 2013, Pages 12-17

  Huang, Cui ^a   Chen, Qianwen ^a   Wu, Dong ^a   Wang, Zheyao ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Capacitance; Poly (propylene carbonate) (PPC); Polymer liner; Three dimensional integration; Through silicon via (TSV)

Indexed keywords

AIR BUBBLES; CAPACITANCE DENSITY; CURRENT LEAKAGE; HIGH ASPECT RATIO; INSULATION LAYERS; LOW DIELECTRIC CONSTANTS; MEASUREMENT RESULTS; POLY(PROPYLENE CARBONATE); POLYMER INSULATION; POLYMER LINERS; SPIN-ON; THREE DIMENSIONAL INTEGRATION; THROUGH SILICON VIAS; THROUGH-SILICON-VIA; VACUUM TREATMENT;

ASPECT RATIO; AUTOMOBILE MANUFACTURE; ELECTRONICS PACKAGING; INSULATION; PIPE LININGS; PLASTIC COATINGS; POLYMERS; SILICA;

CAPACITANCE;

EID: 84871105369     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.11.002     Document Type: Article

References (32)

1. J.U. Knickerbocker, P.S. Andry, B. Dang, R.R. Horton, M.J. Interrante, and C.S. Patel IBM J. Res. Dev. 52 2008 553 569
2. L.W. Schaper, S.L. Burkett, S. Spiesshoefer, G.V. Vangara, Z. Rahman, and S. Polamreddy IEEE Trans. Adv. Packag. 28 2005 356 366
3. J.Q. Lu Proc. IEEE 97 2009 18 30
4. G. Van der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, and C. Torregiani IEEE J. Solid-State Circuits 46 2011 293 307
5. L. Zhang, H.Y. Li, S. Gao, and C.S. Tan IEEE Electron. Dev. Lett. 32 2011 668 670
6. Y.-C. Hsin, C.-C. Chen, J.H. Lau, P.-J. Tzeng, S.-H. Shen, and Y.-F. Hsu IEEE Electron. Comput. Tech. Conf. 2011 1130 1135
7. N. Ranganathan, D.Y. Lee, L. Youhe, G.Q. Lo, K. Prasad, and K.L. Pey IEEE Trans. Compon. Packag. Manuf. Technol. 1 2011 1497 1507
8. J. Bea, K. Lee, T. Fukushima, T. Tanaka, and M. Koyanagi IEEE Electron. Dev. Lett. 32 2011 940 942
9. Y. Yang, R. Labie, F. Ling, C. Zhao, A. Radisic, and J. Van Olmen Microelectron. Reliab. 50 2010 1636 1640
10. Y.C. Tan, C.M. Tan, X.W. Zhang, T.C. Chai, and D.Q. Yu Microelectron. Reliab. 50 2010 1328 1335
11. X. Liu, Q. Chen, P. Dixit, R. Chatterjee, R. Tummala, and S. Sitaraman IEEE Electron. Compon. Technol. Conf. 2009 624 629
12. C.S. Selvanayagam, J.H. Lau, X. Zhang, S. Seah, K. Vaidyanathan, and T.C. Chai IEEE Trans. Adv. Packag. 32 2009 720 728
13. N. Ranganathan, K. Prasad, N. Balasubramanian, and K.L. Pey J. Micromech. Microeng. 18 2008 075018
14. L.C. Shen, C.W. Chien, H.C. Cheng, and C.T. Lin Microelectron. Reliab. 50 2010 489 497
15. S. Schoenfelder, M. Ebert, C. Landesberger, K. Bock, and J. Bagdahn Microelectron. Reliab. 47 2007 168 178
16. M.A.J. van Gils, O. van der Sluis, G.Q. Zhang, J.H.J. Janssen, and R.M.J. Voncken Microelectron. Reliab. 47 2007 179 186
17. S.-K. Ryu, K.-H. Lu, X. Zhang, J.-H. Im, P.S. Ho, and R. Huang IEEE Trans. Dev. Mat. Reliab. 11 2011 35 43
18. I. De Wolf, K. Croes, O.V. Pedreira, R. Labie, A. Redolfi, and M. Van De Peer Microelectron. Reliab. 51 2011 1856 1859
19. C. Selvanayagam, X.W. Zhang, R. Rajoo, and D. Pinjala Comp. Packag. Manuf. Technol. 1 9 2011 1497 1507
20. S.E. Thompson, G. Sun, Y. Choi, and T. Nishida IEEE Trans. Electron. Dev. 53 2006 1010 1020
21. A.P. Karmarker, X. Xu, and V. Moroz IEEE Int. Reliab. Phys. Symp. 2009 682 687
22. J.-S. Yang, K. Athikulwongse, Y.-J. Lee, S.K. Lim, D.Z. Pan, in: Proceedings of Forty Seventh Design Automation Conference, (2010) 803-806.
23. D.S. Tezcan, F. Duval, H. Philipsen, O. Luhn, P. Soussan, and B. Swinnen IEEE Electron. Compon. Technol. Conf. 2009 1159 1164
24. Z. Chen, X. Song, and S. Liu IEEE Electron. Compon. Technol. Conf. 2009 1374 1380
25. B. Majeed, N.P. Pham, D.S. Tezcan, and E. Beyne IEEE Electron. Compon. Technol. Conf. 2008 1556 1561
26. Y. Civale, D.S. Tezcan, H.G.G. Philipsen, F.F.C. Duval, P. Jaenen, and Y. Travaly IEEE Trans. Compon. Packag. Manuf. Technol. 1 2011 833 840
27. F.F.C. Duval, C. Okoro, Y. Civale, P. Soussan, and E. Beyne IEEE Trans. Compon. Packag. Manuf. Technol. 1 2011 825 832
28. P. Chausse, M. Bouchoucha, D. Henry, N. Sillon, and L.L. Chapelon IEEE Electron. Packag. Technol. Conf. 2009 790 794
29. M. Bouchoucha, P. Chausse, D. Henry, and N. Sillon IEEE Electron. Compon. Technol. Conf. 2010 1696 1698
30. M. Bouchoucha, P. Chausse, S. Moreau, L.-L. Chapelon, N. Sillon, and O. Thomas IEEE Electron. Compon. Technol. Conf. 2011 567 572
31. T.T. Chua, S.W. Ho, H.Y. Li, C.H. Khong, E.B. Liao, and S.P. Chew IEEE Electron. Compon. Technol. Conf. 2010 798 802
32. G. Katti, M. Stucchi, K. De Meyer, and W. Dehaene IEEE Trans. Electron. Dev. 57 2010 256 262