Thermo-mechanical characterization of copper filled and polymer filled TSVs considering nonlinear material behaviors

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1374-1380

  Chen, Zhaohui ^a   Song, Xiaohui ^a   Liu, Sheng ^a,b,c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENTS OF THERMAL EXPANSIONS; DIELECTRIC LAYER; ELECTRICAL PERFORMANCE; FINITE ELEMENT ANALYSIS; MODELING RESULTS; NONLINEAR MATERIAL BEHAVIOR; PARYLENES; POLYMER MATERIALS; RISK OF FAILURE; TEMPERATURE CYCLING; TEMPERATURE LOADINGS; THERMO-MECHANICAL; THERMO-MECHANICAL BEHAVIORS; THERMO-MECHANICAL CHARACTERIZATION; THERMO-MECHANICAL STRESS; THROUGH-SILICON-VIA; UNDERFILLS;

ASPECT RATIO; COPPER; ELECTROPLATING; FINITE ELEMENT METHOD; POLYIMIDES; POLYMERS; SILICON COMPOUNDS; THERMAL EXPANSION; THERMAL STRESS; THERMOELASTICITY; THERMOMECHANICAL TREATMENT;

SILICON OXIDES;

EID: 70349659173     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074192     Document Type: Conference Paper

References (14)

1. th International Electronics Manufacturing Symposium. 2004, pp. 64-67.
2. T. Rowbotham, J. Patel, T. Lam et al, "Back Side Exposure of Variable Size Through Silicon Vias," J. Vac. Sci. Technol. B, Vol.24, No.5 (2006), pp. 2460-2466.
3. Gonzalez M., "Influence of Dielectric Material and Via Geometry on the Thermo-mechanical Behavior of Silicon Through Interconnects," Proceeding of the 10th Pan Pacific Microelectronics Symposium, SMTA, Hawaii, 2005, pp. 25-29.
4. Sheng Liu, Yuhai Mei, "Behavior of delaminated Plastic IC Package Subjected to Encapsulation cooling, Moisture Absorption, and Wave Soldering", Transactions on component, packaging, and manfacturing tecknology, IEEE, VOL 18, No 3(1995), pp. 634-645.
5. Sheng Liu, Yuhai Mei, and Tien Y.Wu, "Bimaterial interfacial crack growth as a function of mode-mixity." IEEE Transactions on Components, Packaging, and Manufacturing Technology, VOL 18, No 3 (1995), pp. 618-626.
6. D. S. Tezcan, Nga Pham, B. Majeed et al, "Sloped Through Wafer Vias for 3D Wafer Level Packaging, " Electronic Components and Technology Conference, 2007, pp.643- 647.
7. P. Ramm, M. J. Wolf, A. Klumpp et al, "Through Silicon Via Technology Processes and Reliability for Wafer-Level 3D System Integration," Electronic Components and Technology Conference, 2008, pp. 841-846.
8. Naotaka Tanaka, Tomotoshi Sato, Yasuhiro Yamaji et al, "Mechanical Effects of Copper Through-Vias in a 3D Die- Stacked Module," Electronic Components and Technology Conference, 2002, pp. 473-479.
9. Cheryl S. Selvanayagam, John H. Lau, Xiaowu Zhang et al, "Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and their Flip-Chip Microbumps," Electronic Components and Technology Conference, 2008, pp. 1073-1081.
10. Z. F. Qian, Jianjun Wang, Sheng Liu et al, "Visco-Elastic- Plastic Properties and Constitutive Modeling of Underfills," IEEE Transactions on Components and Packaging Technology, 1999, pp. 151-155.
11. Zhengfang Qian, Minfu Lu, and Sheng Liu et al, "Fatigue Life Prediction of Flip-Chips in Terms of Nonlinear Behaviors of Solder and Underfill," Electronic Components and Technology Conference, 2005, pp. 141- 148.
12. W. Ren, J. Wang, Z. Qian, S. Liu et al, "excl;°Investigation of Nonlinear Behaviors of Packaging Materials and Its Application to a Flip-Chip Package, "excl;° International Symposium on Advanced Packaging Materials,1999, pp. 31-40.
13. Nitesh Kumbhat, P. Markondeya Raj, Raghuram V. Pucha, et al, "Recent Advances in Composite Substrate Materials for High-Density and High Reliability Packaging Applications," Electronic Components and Technology Conference,2005, pp. 1364-1372.
14. Bart Vandevelde, Chukwudi Okoro, Mario Gonzalez, et al, "Thermo-mechanics of 3D-wafer Level and 3D Stacked IC Packaging Technologies," Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE, 2008.