Design issues and considerations for low-cost 3-D TSV IC technology

IEEE Journal of Solid-State Circuits

Volumn 46, Issue 1, 2011, Pages 293-307

  Van Der Plas, Geert ^a   Limaye, Paresh ^a   Loi, Igor ^g   Mercha, Abdelkarim ^a   Oprins, Herman ^a   Torregiani, Cristina ^c   Thijs, Steven ^a   Linten, Dimitri ^a   Stucchi, Michele ^a   Katti, Guruprasad ^a,b   Velenis, Dimitrios ^a   Cherman, Vladimir ^a   Vandevelde, Bart ^a   Simons, Veerle ^a   De Wolf, Ingrid ^a   Labie, Riet ^a   Perry, Dan ^c   Bronckers, Stephane ^d   Minas, Nikolaos ^a   Cupac, Miro ^a   Ruythooren, Wouter ^e   Van Olmen, Jan ^a   Phommahaxay, Alain ^a   De Potter De Ten Broeck, Muriel ^a   Opdebeeck, Ann ^a   Rakowski, Michal ^a   De Wachter, Bart ^a   Dehan, Morin ^a   Nelis, Marc ^a   Agarwal, Rahul ^f   Pullini, Antonio ^h   Angiolini, Federico ^h   Benini, Luca ^g   Dehaene, Wim ^a,b   Travaly, Youssef ^a   Beyne, Eric ^a   Marchal, Paul ^a   more..

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c QUALCOMM INC   (United States)

^d LABORELEC   (Belgium)

^e Photovoltech   (Belgium)

^f INSTITUTE OF MICROELECTRONICS   (Singapore)

^g UNIVERSITY OF BOLOGNA   (Italy)

^h INoCs   (Switzerland)

Author keywords

3 D; CU TSV; ESD; mechanical stress; network on chip; noise coupling; thermal behavior

Indexed keywords

3-D; CU TSV; ESD; MECHANICAL STRESS; NETWORK ON CHIP; NOISE COUPLING; THERMAL BEHAVIORS;

DIGITAL INTEGRATED CIRCUITS; ELECTRIC SIGNAL SYSTEMS; ELECTROSTATIC DEVICES; ELECTROSTATIC DISCHARGE; MOS DEVICES; PROGRAMMABLE LOGIC CONTROLLERS; SERVERS; STRESSES; VLSI CIRCUITS;

THREE DIMENSIONAL;

EID: 78650861793     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2010.2074070     Document Type: Conference Paper

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