Three-dimensional silicon integration

IBM Journal of Research and Development

Volumn 52, Issue 6, 2008, Pages 553-569

  Knickerbocker, John U ^a   Andry, Paul S ^a   Dang, Bing ^a   Horton, Raymond R ^a   Interrante, Mario J ^b   Patel, Chirag S ^a   Polastre, Robert J ^a   Sakuma, Katsuyuki ^c   Sirdeshmukh, Ranjani ^a   Sprogis, Edmund J ^d   Sri Jayantha, Sri M ^a   Stephens, Antonio M ^e   Topol, Anna W ^a   Tsang, Cornelia K ^a   Webb, Bucknell C ^a   Wright, Steven L ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b Systems and Technology Group   (United States)

^c IBM RESEARCH TOKYO   (Japan)

^d IBM   (United States)

^e IBM AUSTIN RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE MANUFACTURE; COMMERCE; COST REDUCTION; DEMONSTRATIONS; ELECTRONICS PACKAGING; FABRICATION; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATION; MINIATURE INSTRUMENTS; PRODUCT DESIGN; SILICON; STRUCTURAL DESIGN;

HISTORICAL PERSPECTIVE; INTERCONNECTION DENSITY; PERFORMANCE ENHANCEMENTS; PRODUCT MINIATURIZATION; PRODUCT OPTIMIZATION; TECHNOLOGY INTEGRATION; THREE DIMENSIONAL INTEGRATION; THREEDIMENSIONAL (3-D);

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 61649110276     PISSN: 00188646     EISSN: 00188646     Source Type: Journal    
DOI: 10.1147/JRD.2008.5388564     Document Type: Review

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