The correlation between the intermetallic compounds growth pattern and the addition in the solder matrix

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Gao, F ^a   Takemoto, T ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; GRAIN GROWTH; MICROSTRUCTURE; NUCLEATION; SOLDERING;

ABNORMAL GRAIN GROWTH; GROWTH RATE; SOLDER MATRIX; SOLDERING TIME;

INTERMETALLICS;

EID: 33847170369     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644062     Document Type: Conference Paper

References (10)

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