Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach

Journal of Alloys and Compounds

Volumn 509, Issue 3, 2011, Pages 878-884

  Xu, Guangchen ^a   Guo, Fu ^a   Wang, Xitao ^b   Xia, Zhidong ^a   Lei, Yongping ^a   Shi, Yaowu ^a   Li, Xiaoyan ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Composite solder; Electromigration; Eutectic SnBi; Ni particle

Indexed keywords

BARRIER LAYERS; COMPOSITE SOLDERS; CURRENT-STRESSING; EFFECTIVE SOLUTION; ELECTRONIC SOLDERS; FLIP CHIP SOLDER JOINTS; HIGH CURRENT DENSITIES; INTERMETALLIC COMPOUNDS; METALLIZATIONS; NI PARTICLES; PHASE SEGREGATIONS; SOLDER JOINTS; SOLDER MATRIX;

ELECTROMIGRATION; EUTECTICS; INTERMETALLICS; PHASE SEPARATION; SOLDERING ALLOYS;

TIN;

EID: 78449235439     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.09.123     Document Type: Article

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