Solders strengthened with nickel particles

Advanced Materials and Processes

Volumn 162, Issue 8, 2004, Pages 81-82

  Guo, F ^a   Lee, J ^a   Subramanian, K N ^a  

^a MICHIGAN STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDER; CREEP RESISTANCE; INTERMETALLIC MATRIX COMPOSITE; NICKEL PARTICLE REINFORCED COMPOSITE SOLDER JOINTS; SOLID STATE ISOTHERMAL AGING;

AGING OF MATERIALS; CREEP; INTERMETALLICS; MECHANICAL ALLOYING; METALLIC MATRIX COMPOSITES; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; NICKEL; PARTICLES (PARTICULATE MATTER); REINFORCEMENT; STRENGTHENING (METAL); TIN ALLOYS;

SOLDERED JOINTS;

EID: 4344622816     PISSN: 08827958     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)