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Volumn 39, Issue 12, 2010, Pages 2553-2557

Microstructure changes and physical properties of the intermetallic compounds formed at the interface between Sn-Cu solders and a Cu substrate due to a minor addition of Ni

Author keywords

intermetallic layer formation; mechanical behavior; Ni addition; Pb free solders; Sn Cu alloys

Indexed keywords

CU ALLOY; INTERMETALLIC LAYER; MECHANICAL BEHAVIOR; NI ADDITIONS; PB FREE SOLDERS;

EID: 78049527351     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1373-3     Document Type: Conference Paper
Times cited : (11)

References (7)
  • 1
    • 78049529118 scopus 로고    scopus 로고
    • RoHS-Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment
    • RoHS-Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment.
  • 3
    • 33846411062 scopus 로고    scopus 로고
    • Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives
    • DOI 10.1007/s11664-006-0317-4
    • F Gao T Takemoto 2006 J. Electron. Mater. 35 2081 1:CAS:528: DC%2BD2sXms1eltg%3D%3D 10.1007/s11664-006-0317-4 2006JEMat..35.2081G (Pubitemid 46140895)
    • (2006) Journal of Electronic Materials , vol.35 , Issue.12 , pp. 2081-2087
    • Gao, F.1    Takemoto, T.2    Nishikawa, H.3
  • 4
    • 0348107255 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD3sXpslSmtrk%3D 10.1007/s11664-003-0012-7 2003JEMat.32.1203T
    • JI Tsai IC Hu CR Kao 2003 J. Electron. Mater. 32 1203 1:CAS:528:DC%2BD3sXpslSmtrk%3D 10.1007/s11664-003-0012-7 2003JEMat..32.1203T
    • (2003) J. Electron. Mater. , vol.32 , pp. 1203
    • Tsai, J.I.1    Hu, I.C.2    Kao, C.R.3
  • 7
    • 37249093525 scopus 로고    scopus 로고
    • The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys
    • DOI 10.1007/s11664-007-0248-8
    • CM Gourlay J Read K Nogita 2008 J. Electron. Mater. 37 51 1:CAS:528:DC%2BD1cXmtV2isw%3D%3D 10.1007/s11664-007-0248-8 2008JEMat..37...51G (Pubitemid 350276009)
    • (2008) Journal of Electronic Materials , vol.37 , Issue.1 , pp. 51-60
    • Gourlay, C.M.1    Read, J.2    Nogita, K.3    Dahle, A.K.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.