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Volumn 39, Issue 12, 2010, Pages 2553-2557
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Microstructure changes and physical properties of the intermetallic compounds formed at the interface between Sn-Cu solders and a Cu substrate due to a minor addition of Ni
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Author keywords
intermetallic layer formation; mechanical behavior; Ni addition; Pb free solders; Sn Cu alloys
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Indexed keywords
CU ALLOY;
INTERMETALLIC LAYER;
MECHANICAL BEHAVIOR;
NI ADDITIONS;
PB FREE SOLDERS;
ADDITION REACTIONS;
COPPER ALLOYS;
DISSOLUTION;
FACE RECOGNITION;
GROWTH KINETICS;
INTERMETALLICS;
LEAD;
MECHANICAL ENGINEERING;
MORPHOLOGY;
PHASE INTERFACES;
SOLDERING ALLOYS;
SUBSTRATES;
TIN ALLOYS;
TIN;
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EID: 78049527351
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-010-1373-3 Document Type: Conference Paper |
Times cited : (11)
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References (7)
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