Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives

Journal of Electronic Materials

Volumn 35, Issue 12, 2006, Pages 2081-2087

  Gao, Feng ^a   Takemoto, Tadashi ^a   Nishikawa, Hiroshi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Intermetallic compounds (IMCs); Lead free solder; Morphology

Indexed keywords

DUPLEX STRUCTURES; LEAD FREE SOLDERS; PATTERN TRANSITION; SIZE DISTRIBUTION;

COPPER; DOPING (ADDITIVES); ENTHALPY; GRAIN GROWTH; MORPHOLOGY; SOLDERING; TIN;

INTERMETALLICS;

EID: 33846411062     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0317-4     Document Type: Conference Paper

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