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Volumn 39, Issue 4, 2010, Pages 426-432

Additive occupancy in the Cu 6Sn 5-based intermetallic compound between Sn-3.5ag solder and cu studied using a first-principles approach

(3) Gao, Feng a,b Qu, Jianmin a,b Takemoto, Tadashi c

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

b Northwestern University (United States)

c OSAKA UNIVERSITY (Japan)

Author keywords

Additive; Density of states; First principles; Intermetallic compounds; Solder

Indexed keywords

CO-DOPANTS; CONCENTRATION LEVELS; CU ATOMS; CU SUBSTRATE; DENSITY OF STATE; FIRST-PRINCIPLES; FIRST-PRINCIPLES APPROACHES; INTERMETALLIC COMPOUNDS; NI ATOMS; PARTIAL DENSITY OF STATE; SN-3.5AG; SN-BASED SOLDERS; STRUCTURAL STABILITIES; SUB-LATTICES; THERMODYNAMICALLY STABLE;

ATOMS; COBALT COMPOUNDS; CRYSTAL STRUCTURE; DENSITY FUNCTIONAL THEORY; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; STABILITY;

TIN;

EID: 77951025512 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1093-8 Document Type: Article

Times cited : (48)

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