Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates

Acta Materialia

Volumn 57, Issue 16, 2009, Pages 4697-4706

  Shang, P J ^a   Liu, Z Q ^a   Pang, X Y ^a   Li, D X ^a   Shang, J K ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Cu3Sn; Growth mechanism; Interface; Soldering; Transmission electron microscopy

Indexed keywords

COLUMNAR GROWTH; CU SUBSTRATE; CU3SN; FINE EQUIAXED GRAINS; GROWTH BEHAVIOR; GROWTH MECHANISM; GROWTH MECHANISMS; INTERFACE; NUCLEATION AND GROWTH; POLYCRYSTALLINE; POLYCRYSTALLINE SUBSTRATES; RAPID GROWTH; REACTIVE ELEMENTS; SINGLE-CRYSTALLINE; SN GRAINS; SOLDER JOINTS; SOLDER REFLOW; SOLID-STATE AGING; TEM; TRIPLE JUNCTION; UNIFORM LAYER;

BRAZING; CRYSTALLINE MATERIALS; ELECTRON MICROSCOPES; LIGHT TRANSMISSION; NUCLEATION; SOLDERING ALLOYS; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY; WELDING;

TIN;

EID: 68949085298     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.06.025     Document Type: Article

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