The effects of Ni nanoparticles addition on shear behavior and microstructure of Sn-Ag lead-free solder

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Qi, Fangjuan ^a   Sun, Li ^a   Hou, Zhezhe ^a   Wang, Jianqiang ^a   Qin, Cha ^a  

^a SHIJIAZHUANG TIEDAO UNIVERSITY   (China)

Author keywords

IMC; Lead free solder; Microstructure; Ni nanoparticles; Shear performance

Indexed keywords

BRAZING; COPPER; ELECTRONICS PACKAGING; LEAD; NANOCOMPOSITES; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NICKEL; NICKEL ALLOYS; SILVER; SOLDERED JOINTS; SOLDERING; TECHNOLOGY; TIN ALLOYS; WELDING;

DISPERSANT; ELECTRONIC PACKAGING; HIGH-DENSITY PACKAGING; IMC; INTERNATIONAL CONFERENCES; LEAD-FREE SOLDER; LEAD-FREE SOLDER PASTES; MICROSTRUCTURE; NI NANOPARTICLES; NICKEL NANO-PARTICLES; SHEAR BEHAVIOR; SHEAR FORCE; SHEAR PERFORMANCE; SHEAR PROPERTIES;

TIN;

EID: 52449093897     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607054     Document Type: Conference Paper

References (6)

1. Arulvanan Periannan, Zhong Zhaowei, Shi Xunqing. "Effects of process conditions on reliability, microstructare evolution and failure modes of SnAgCu solder joints". Microelecton Reliab, Vol.64 (2006), pp. 432-439
2. Fu Guo, Lead-free Soldering Technology and Application, Science Press (2006), pp.195-199
3. Liu Zhi Jie, "Effects of Ni Element on the Property of Vacuum Brazing Joint of Al-Si-Cu Base Alloy," Aluminum fabrication, Vol. 164, No. 5 (2005), pp. 6-8
4. G. Martin, "An overview of the current status of lead-free assembly and related issues," Circuit World, Vol. 29, No. 4(2005), pp. 23-27
5. Lu Chengjie, Zhang Zhenzhong, Zhou Jianqiu, Zhang Shaoming, " Influence of Different Dispersants on the Dispersion Stabilities of Nickel Nanopowders in Ethanol" , Materials Review, Vol. 21, No. 8(2007), pp.165-166
6. D. Ma, W. D. Wang, and S. K. Lahiri, "Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow". Journal Of Applied Physics (2002), Vol. 91, No. 5, pp. 3312-3317