Effects of Ni addition on the interfacial reactions between Sn-Cu solders and Ni substrate

Intermetallics

Volumn 18, Issue 4, 2010, Pages 616-622

  Wang, Chao hong ^a   Shen, Han ting ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

A. Intermetallics, miscellaneous; B. Bonding; B. Phase transformations; C. Joining

Indexed keywords

A. INTERMETALLICS, MISCELLANEOUS; B. PHASE TRANSFORMATIONS; GRADUAL CHANGES; INTERFACIAL REACTIONS; INTERMETALLICS , MISCELLANEOUS; MORPHOLOGY CHANGES; NI ADDITIONS; NI CONTENT; NI SUBSTRATES; PHASE TRANSFORMATION; REACTION PHASE; SN-CU SOLDERS; SOLDER BALLS; SPREADING EFFECTS;

ADDITION REACTIONS; INTERMETALLICS; JOINING; MICROSTRUCTURE; MORPHOLOGY; PHASE INTERFACES; PHASE TRANSITIONS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 77649185410     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2009.10.018     Document Type: Article

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