Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires

Journal of Micromechanics and Microengineering

Volumn 22, Issue 10, 2012, Pages

  Fischer, A C ^a   Bleiker, S J ^a   Haraldsson, T ^a   Roxhed, N ^a   Stemme, G ^a   Niklaus, F ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE PATHS; COST DRIVERS; HIGH ASPECT RATIO; INTEGRATED DEVICE; INTEGRATED SYSTEMS; INTERNAL SIGNALS; LOW COST FABRICATION; MAGNETIC ASSEMBLY; METAL FILLING; METALLIZATION PROCESS; NICKEL WIRES; PARASITICS; THROUGH SILICON VIAS; THROUGH-WAFER VIAS; VIA HOLE; WAFER THINNING;

ELECTRONICS PACKAGING; SILICON WAFERS; WIRE;

ASPECT RATIO;

EID: 84866321637     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/10/105001     Document Type: Article

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