Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 630-634

  Lu, Kuan H ^a   Zhang, Xuefeng ^a   Ryu, Suk Kyu ^b   Im, Jay ^a   Huang, Rui ^b   Ho, Paul S ^a  

^a The University of Texas at Austin   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; A-THERMAL; ANALYTICAL METHOD; ANALYTICAL SOLUTIONS; CRACK DRIVING FORCE; FEA SIMULATION; FINITE ELEMENT ANALYSIS; INTERCONNECT STRUCTURES; LINE CONFIGURATION; LINEAR SUPERPOSITIONS; PERFORMANCE DEGRADATION; STRESS DISTRIBUTION; STRESS INTERACTION; STRESS SOLUTIONS; THERMOMECHANICAL RELIABILITY; THROUGH SILICON VIAS;

CRACKS; STRESS CONCENTRATION; THERMAL STRESS; THERMOANALYSIS; THERMOELASTICITY; THERMOMECHANICAL TREATMENT; THREE DIMENSIONAL;

RELIABILITY ANALYSIS;

EID: 70349670752     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074079     Document Type: Conference Paper

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