High aspect ratio TSVs fabricated by magnetic self-assembly of gold-coated nickel wires

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 541-547

  Fischer, A C ^a   Bleiker, S J ^a   Somjit, N ^a   Roxhed, N ^a   Haraldsson, T ^a   Stemme, G ^a   Niklaus, F ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CONVENTIONAL APPROACH; ELECTRICAL CHARACTERISTIC; EMERGING TECHNOLOGIES; FABRICATION TECHNIQUE; GOLD-COATED; HIGH-ASPECT RATIO; MANUFACTURING TECHNOLOGIES; METAL DEPOSITION; NICKEL RODS; NICKEL WIRES; PARASITIC CAPACITANCE; PRODUCTION COST; RF APPLICATIONS; SIGNAL LENGTH; STACKED DIE; THREE DIMENSIONAL (3D) INTEGRATION; THROUGH SILICON VIAS; THROUGH-SILICON-VIA HOLE; THROUGH-WAFER VIAS;

FABRICATION; GOLD; GOLD COATINGS; NICKEL; SELF ASSEMBLY; SILICON WAFERS; TECHNOLOGY;

ASPECT RATIO;

EID: 84866328428     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248882     Document Type: Conference Paper

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