Innovative through-silicon-via formation approach for wafer-level packaging applications

Journal of Micromechanics and Microengineering

Volumn 22, Issue 4, 2012, Pages

  Tang, Chao Wei ^a   Young, Hong Tsu ^a   Li, Kuan Ming ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; SILICON WAFERS; WET ETCHING;

DEEP REACTIVE ION ETCHING; EMERGING TECHNOLOGIES; FABRICATION METHODOLOGY; INDUSTRIAL PRODUCTION; NANOSECOND LASER PULSE; NANOSECOND PULSED LASER; THREE DIMENSIONAL INTEGRATED CIRCUITS; WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 84866340693     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/4/045019     Document Type: Article

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