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Volumn 85, Issue 9, 1999, Pages 6421-6424
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Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films
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Author keywords
[No Author keywords available]
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Indexed keywords
ELASTIC MODULI;
FINITE ELEMENT METHOD;
FOURIER TRANSFORM INFRARED SPECTROSCOPY;
POISSON RATIO;
SEMICONDUCTING GALLIUM ARSENIDE;
SILANES;
SILICA;
SILICON WAFERS;
STRESS ANALYSIS;
THERMAL EFFECTS;
THERMAL EXPANSION;
THERMAL STRESS;
BENDING BEAM METHOD;
TETRAETHYLORTHOSILANE;
THERMAL EXPANSION COEFFICIENTS;
DIELECTRIC FILMS;
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EID: 0032613383
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.370146 Document Type: Article |
Times cited : (120)
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References (18)
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