High-throughput on-chip large deformation of silicon nanoribbons and nanowires

Journal of Microelectromechanical Systems

Volumn 21, Issue 4, 2012, Pages 822-829

  Passi, Vikram ^a,b   Bhaskar, Umesh ^a   Pardoen, Thomas ^c   Södervall, Ulf ^d   Nilsson, Bengt ^d   Petersson, Göran ^d   Hagberg, Mats ^d   Raskin, Jean Pierre ^a  

^a UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

^b INSTITUT D ELECTRONIQUE   (France)

^c Materials and Civil Engineering   (Belgium)

^d CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Fracture strain; nanoelectromechanical systems (NEMS); on chip testing; silicon nanowires (Si NWs); tensile testing; Weibull statistics

Indexed keywords

FRACTURE STRAIN; NANO ELECTROMECHANICAL SYSTEMS; ON CHIPS; SILICON NANOWIRES; WEIBULL STATISTICS;

ELECTROMECHANICAL COUPLING; FRACTURE; NANOWIRES; STRAIN; STRESSES; TENSILE TESTING; WEIBULL DISTRIBUTION;

DEFORMATION;

EID: 84864578184     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2012.2190711     Document Type: Article

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