Microscale materials testing using MEMS actuators

Journal of Microelectromechanical Systems

Volumn 10, Issue 1, 2001, Pages 146-152

  Haque, M A ^a   Saif, M T A ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Bending test; MEMS; Tensile testing; Thin films

Indexed keywords

BENDING (DEFORMATION); IMAGE ANALYSIS; IMAGE QUALITY; MICROELECTROMECHANICAL DEVICES; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; TENSILE TESTING; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

CANTILEVER BENDING TESTING; MICROSCALE MATERIALS TESTING;

MICROACTUATORS;

EID: 0035279276     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.911103     Document Type: Article

References (17)

1. Mechanical testing of thin films
2. Micromechanical tensile testing
3. Investigation of micro-scale materials behavior with MEMS
4. Thickness dependent mechanical behavior of submicron aluminum films
5. Tensile properties of aluminum/alumina multi-layered thin films
6. Mechanical properties of thin films
7. Piezo-actuated microtensile test apparatus
8. A new method for tensile testing of thin films
9. Measurement of forces and spring constants of microinstruments
10. SCREAM I: A single mask single-crystal silicon, reactive ion etching process for micro-electro-mechanical structures
11. Mechanical properties of thin films and multilayers
12. Laterally driven polysilicon resonant microstructures
13. Mechanical behavior of thin films
14. Mechanical testing of polysilicon thin films
15. Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films