Measurement of the bending strength of vapor-liquid-solid grown silicon nanowires

Nano Letters

Volumn 6, Issue 4, 2006, Pages 622-625

  Hoffmann, Samuel ^a   Utke, Ivo ^a   Moser, Benedikt ^a   Michler, Johann ^a   Christiansen, Silke H ^b,c   Schmidt, Volker ^b   Senz, Stephan ^b   Werner, Peter ^b   Gǒsele, Ulrich ^b   Ballif, Christophe ^d  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^c MARTIN LUTHER UNIVERSITY HALLE WITTENBERG   (Germany)

^d UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; BENDING STRENGTH; CRYSTAL GROWTH; ELASTIC MODULI; FRACTURE TOUGHNESS; SCANNING ELECTRON MICROSCOPY; SILICON;

FRACTURE INITIATION; NANOWIRE DEFLECTION; SILICON NANOWIRES; VAPOR-LIQUID-SOLID PROCESSES;

NANOSTRUCTURED MATERIALS;

NANOTUBE; SILICON;

ARTICLE; ATOMIC FORCE MICROSCOPY; CHEMICAL MODEL; CHEMISTRY; COMPUTER SIMULATION; CONFORMATION; CRYSTALLIZATION; ELASTICITY; MACROMOLECULE; MATERIALS TESTING; MECHANICAL STRESS; MECHANICS; METHODOLOGY; NANOTECHNOLOGY; PARTICLE SIZE; PROTEIN BINDING; TENSILE STRENGTH; ULTRASTRUCTURE;

COMPUTER SIMULATION; CRYSTALLIZATION; ELASTICITY; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MECHANICS; MICROSCOPY, ATOMIC FORCE; MODELS, CHEMICAL; MOLECULAR CONFORMATION; NANOTECHNOLOGY; NANOTUBES; PARTICLE SIZE; PROTEIN BINDING; SILICON; STRESS, MECHANICAL; TENSILE STRENGTH;

EID: 33646389840     PISSN: 15306984     EISSN: None     Source Type: Journal    
DOI: 10.1021/nl052223z     Document Type: Article

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