Multipurpose nanomechanical testing machines revealing the size-dependent strength and high ductility of pure aluminium submicron films

Micro and Nano Letters

Volumn 2, Issue 1, 2007, Pages 13-16

  Fabregue D ^a   Andre N ^a   Coulombier, M ^a   Raskin, J P ^a   Pardoen, T ^a  

^a UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; DEFORMATION; DUCTILITY; LOADS (FORCES); POLYMER FILMS; STRENGTH OF MATERIALS;

ALUMINIUM SUBMICRON FILMS; NANOMECHANICAL TESTING MACHINES; NANOTESTING METHODS; SUBMICRON DIMENSIONS;

NANOMECHANICS;

ALLOY; ALUMINUM; POLYMER;

ARTICLE; CERAMICS; INFORMATION PROCESSING; LABORATORY AUTOMATION; MATERIALS TESTING; MICROSCOPE IMAGE; MOLECULAR MECHANICS; NANOANALYSIS; NANOIMAGING;

EID: 34249804496     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl:20065068     Document Type: Article

References (35)

1. Fleck, N.A.: et al. ' Strain gradient plasticity: theory and experiment ', Acta Metall. Mater, 1994, 42, p. 475-487 10.1016/0956-7151(94)90502-9 0956-7151
2. van der Giessen, E.: ' Plasticity in the 21st century ', Aref, H., Philips, J.W., Mechanics for a new millenium, (Kluwer Academic Publishers, 2001), p. 413-428
3. Prorok, B.C.: ' Micro- and nanomechanics ', et al., Nalwa, H.S., Encyclopedia of nanoscience and nanotechnology, (American Scientific Publishers, 2004), p. 555-600
4. Gerberich, W.W.: et al. ' Nanoprobing fracture length scales ', Int. J. Fract, 2006, 138, p. 75-100 10.1007/s10704-006-7155-5 0376-9429
5. Ghoniem, N.M.: et al. ' Multiscale modelling of nanomechanics and micromechanics: an overview ', Phil. Mag., 2003, 83, p. 3475-3528
6. Nix, W.D.: ' Elastic and plastic properties of thin films on substrates: nanoindentation techniques ', Mater. Sci. Eng. A, 1997, 234-236, p. 37-44
7. Lilleodden, E.T., and Nix, W.D.: ' Microstructural length-scale effects in the nanoindentation behavior of thin gold films ', Acta Mater., 2006, 54, p. 1583-1593 10.1016/j.actamat.2005.11.025
8. Gerberich, W.W.: et al. ' Superhard silicon nanospheres ', J. Mech. Phys. Solids, 2003, 51, p. 979-992 10.1016/S0022-5096(03)00018-8 0022-5096
9. Delincé, M., Jacques, P.J., and Pardoen, T.: ' Separation of size-dependent strengthening contributions in fine-grained dual-phase steels by nanoindentation ', Acta Mater., 2006, 54, p. 2547-2555
10. Durst, K.: et al. ' Indentation size effect in metallic materials: Modeling strength from pop-in to macroscopic hardness using geometrically necessary dislocations ', Acta Mater., 2006, 54, p. 3395-3404
11. Zhang, T.-Y.: et al. ' Microbridge testing of silicon nitride thin films deposited on silicon wafers ', Acta Mater., 2000, 48, p. 2843-2857 10.1016/S1359-6454(00)00088-4
12. Espinosa, H.D., Prorok, B.C., and Peng, B.: ' Plasticity size effects in free-standing submicron polycrystalline FCC films subjected to pure tension ', J. Mech. Phys. Solids, 2004, 52, p. 667-689 10.1016/j.jmps.2003.07.001 0022-5096
13. Florando, J.N., and Nix, W.D.: ' A microbeam method for studying stress-strain relations for metal thin films on silicon substrates ', J. Mech. Phys. Solids, 2005, 53, p. 619-638 0022-5096
14. Tsai, H.C.: et al. ' A reliable test key for thin film mechanical properties characterization ', Proc. 12th Int. Conf. on Solid State Sensors, Actuators and Microsystems, Boston, June, 8-12, 2003, p. 452-455
15. Delrio, F.W.: et al. ' The role of van dar Waals forces in adhesion of micromachined surfaces ', Nature Mater., 2005, 4, p. 629-634 10.1038/nmat1431 1476-1122
16. Nicola, L.: et al. ' Plastic deformation of freesting thin films: experiments and modelling ', J. Mech. Phys. Solids, 2006, 54, p. 2089-2110 0022-5096
17. Stolken, J.S., and Evans, A.G.: ' A microbend test method for measuring the plasticity length scale ', Acta Mater., 1998, 46, p. 5109-5115
18. Freund, L.B., and Suresh, S.: ' Thin film materials ', (Cambridge University Press, 2003)
19. Venkatraman, R., and Bravman, J.C.: ' Separation of film thickness and grain boundary strengthening effects in Al thin films on Si ', J. Mater. Res., 1992, 7, p. 2040-2048 0884-2914
20. Uchic, M.D.: et al. ' Sample dimensions influence strength and crystal plasticity ', Science, 2004, 305, p. 986-989 10.1126/science.1098993 0036-8075
21. Greer, J.R., Oliver, W.C., and Nix, D.W.: ' Size dependence of mechanical properties of gold at the micron scale in the absence of strain gradients ', Acta Mater., 2005, 53, p. 1821-1830 10.1016/j.actamat.2004.12.031
22. Sharpe, W.N.: et al. ' Fracture strength of silicon carbide microspecimens ', J. Mems., 2005, 14, p. 903-913
23. Haque, M.A., and Saif, M.T.A.: ' Deformation mechanisms in free-standing nanoscale thin films: a quantitative in situ transmission electron microscope study ', Proc. Natl. Acad. Sci., 2004, 101, p. 6335-6340
24. Haque, M.A., and Saif, M.T.A.: ' Microscale materials testing using MEMS actuators ', J. Microelectromech Syst., 2001, 10, p. 146-162 10.1109/84.911103 1057-7157
25. Haque, M.A., and Saif, M.T.A.: ' A review of MEMS-based microscale and tensile and bending testing ', Exp. Mech., 2003, 43, p. 248-255 10.1007/BF02410523 0014-4851
26. Tsuchiya, T.: et al. ' Cross comparison of thin-film tensile testing methods examined using single-crystal silicon, polysilicon, nickel and titanium films ', J. Microelectromech Syst., 2005, 14, p. 903-913 1057-7157
27. Que, L., Park, J.S., and Gianchandani, Y.B.: ' Bent-beam electrothermal actuators - Part I: Single beam and cascaded devices ', J. Microelectromech Syst., 10, p. 247-254 10.1109/84.925771 1057-7157
28. Iker, F., André, N., Pardoen, T., and Raskin, J.-P.: ' One-mask CMOS compatible process for the fabrication of three-dimensional self-assembled thin film SOI MEMS ', Electroch. Solid-State Lett., 2005, 8-10, p. H87-H89
29. Iker, F., André, N., Pardoen, T., and Raskin, J.-P.: ' Three-dimensional self-assembled sensors in thin film SOI technology ', IEEE J. Microelectromech. Syst., December, 2006, 15, (6), p. 1687-1697
30. Freund, L.B.: ' The stability of a dislocation threading a strained layer on a substrate ', J. Appl. Mech., 1987, 54, p. 553-557
31. Wang, Y.: et al. ' High tensile ductility in a nanostructured metal ', Nature, 2002, 419, p. 912-914 0028-0836
32. ' User's manual ', (Hibbit, Karlsson & Sorensen, Inc., Providence, RI, USA, 2004), ABAQUS/Standard version 6.5.
33. Pardoen, T.: et al. ' Mode I fracture of sheet metal ', J. Mech. Phys. Solids, 2004, 52, p. 423-452 10.1016/S0022-5096(03)00087-5 0022-5096
34. Sinclair, C.W., Poole, W.J., and Brechet, Y.: ' A model for the grain size dependent work hardening of copper ', Scr. Mater., 2006, 55, p. 739 1359-6462
35. Zhu, Y., and Espinosa, H.D.: ' An electromechanical material testing system for in situ electron microscopy and applications ', Proc. Natl. Acad. Sci. USA, 2005, 102, p. 14503-14508 10.1073/pnas.0506544102 0027-8424