Thin films stress extraction using micromachined structures and wafer curvature measurements

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 219-226

  Laconte, J ^a   Iker, F ^a,b   Jorez, S ^a   Andre N ^a   Proost, J ^a   Pardoen, T ^a   Flandre, D ^a   Raskin, J P ^a  

^a UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

^b IMEC   (Belgium)

Author keywords

Anisotropic silicon etching; Cantilevers; Clamped clamped beams; Gauges; Residual stress; Rings; Stoney; Substrate curvature

Indexed keywords

ANISOTROPY; DIELECTRIC FILMS; ETCHING; MICROMACHINING; MICROSTRUCTURE; RESIDUAL STRESSES; THIN FILMS;

ANISOTROPIC SILICON ETCHING; STRESS MEASUREMENTS; SUBSTRATE CURVATURE;

MICROELECTRONICS;

EID: 4544221593     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.003     Document Type: Conference Paper

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