Laser-enabled advanced packaging of ultrathin bare dice in flexible substrates

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 4, 2012, Pages 569-577

  Marinov, Val ^a   Swenson, Orven ^b   Miller, Ross ^b   Sarwar, Ferdous ^b   Atanasov, Yuriy ^b   Semler, Matthew ^b   Datta, Samali ^b  

^a North Dakota State University   (United States)

^b NORTH DAKOTA STATE UNIVERSITY   (United States)

Author keywords

Embedded chips; flexible electronics; laser induced forward transfer; ultrathin semiconductor die

Indexed keywords

ADVANCED PACKAGING; BANK CARDS; COST-EFFICIENT; EMBEDDED CHIPS; FLEXIBLE SUBSTRATE; HIGH THROUGHPUT; LASER INDUCED FORWARD TRANSFER; NANOSCALE SCIENCE AND ENGINEERING; NORTH DAKOTA STATE UNIVERSITIES; PRODUCT DESIGNERS; RADIO FREQUENCIES; RF-ID TAGS; ULTRA-THIN; ULTRA-THIN CHIPS;

FLEXIBLE ELECTRONICS; PACKAGING; RADIO FREQUENCY IDENTIFICATION (RFID); RADIO NAVIGATION; SEMICONDUCTOR LASERS;

SUBSTRATES;

EID: 84859762839     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2176941     Document Type: Article

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