Simple, inexpensive, and reliable, high density interconnect technology for flexible electronics applications

2009 Flexible Electronics and Displays Conference and Exhibition, FLEX 2009

Volumn , Issue , 2009, Pages

  Bhattacharya, Sourin ^a   Marinov, Val ^a  

^a NORTH DAKOTA STATE UNIVERSITY   (United States)

Author keywords

Flexible electronics; Interconnect technology

Indexed keywords

ADDITIVE TECHNOLOGY; CONDUCTIVE POLYMER; DEEP TRENCH; DIRECT WRITE; EDGE DEFINITION; ELECTRONIC COMPONENT; FLEXIBLE ELECTRONICS; FLEXIBLE PRINTED CIRCUIT BOARDS; FLEXIBLE SUBSTRATE; HIGH DENSITY INTERCONNECTS; HIGH RESOLUTION; HIGH-DENSITY; HIGH-PRECISION; HIGH-RESOLUTION PATTERNS; HIGH-THROUGHPUT TECHNOLOGIES; INCREASING PRODUCTION; INTERCONNECT APPLICATIONS; INTERCONNECT TECHNOLOGY; KEY FACTORS; LASER MICRO-MACHINING; MECHANICAL STRESS; MESOSCALE; METAL PARTICULATES; MICROMACHINED; POLYIMIDE FILM; PRODUCTION COST; SCREEN-PRINTED; SURFACE ENERGIES; THIN-FILM TECHNOLOGY; ULTRA-SMALL;

APPROXIMATION THEORY; CONDUCTING POLYMERS; CURING; EXCIMER LASERS; EXPERIMENTS; GAS LASERS; POLYIMIDES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; STRESSES; SUBSTRATES; SURFACE CHEMISTRY; SURFACE TENSION; THICK FILMS; THROUGHPUT;

TECHNOLOGY;

EID: 70349929676     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/FEDC.2009.5069277     Document Type: Conference Paper

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