Chip embedding in laminates

Ultra-thin Chip Technology and Applications

Volumn , Issue , 2011, Pages 159-165

  Kugler, Andreas ^a   Koyuncu, Metin ^a   Zimmermann, André ^a   Kostelnik, Jan ^a  

^a ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84859736435     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_14     Document Type: Chapter

References (11)

1. Tumala R, Swaminathan M (2008) Introduction to system-on-package. McGraw-Hill, New York
2. Reichl H et al. (2009) Heterogeneous integration: building the foundation for innovative products. In: Zhang QG, Roosmalen A (eds.) More than Moore: creating high value micro/nanoelectronics systems, 1st edn. Springer, Berlin
3. Barton J (2008) Embedded microelectronic subsystems. In: Delaney K (ed.) Ambient intelligence with microsystems: augmented materials and smart objects, 1st edn. Springer, New York
4. Chanchani R (2008) 3D integration technologies - an overview. In: Lu D, Wong CP (eds.) Materials for advanced packaging, 1st edn. Springer, New York
5. US Patent #6, 400, 573 B1, 2002
6. Ostmann A et al. (2002) Realization of a stackable package using chip in polymer technology. Polytronic Conference, Zalaegerszeg, Hungary, June 2002, pp 160-164
7. German Patent No. DE102008009220A1, 2008
8. German Patent No. DE102005032489B3, 2005
9. German Patent No. DE102007024189A1, 2007
10. German Patent No. DE102008009220A1, 2008
11. www.project-interflex.eu