Excimer laser ablation of high aspect ratio microvias using a novel sensitizer-enhanced photopolymer

Journal of Microelectronics and Electronic Packaging

Volumn 8, Issue 2, 2011, Pages 66-71

  Sarwar, F ^a   Chen, Z ^a   Wu, J ^a   Webster, D C ^a   Marinov, V R ^b  

^a NORTH DAKOTA STATE UNIVERSITY   (United States)

^b North Dakota State University   (United States)

Author keywords

Laser ablation; Microvias; Negative tone photoresist; Sensitizer

Indexed keywords

ABLATION; EXCIMER LASERS; LASER ABLATION; PHOTORESISTS; THICK FILMS;

ABLATION RATES; HIGH ASPECT RATIO; HIGH ASPECT RATIO MICROSTRUCTURES; LASER FABRICATION; MICROVIAS; NEGATIVE TONE PHOTORESIST; SENSITIZER; THICK LAYERS;

ASPECT RATIO;

EID: 84859758219     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/imaps.294     Document Type: Article

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