Gold/tin soldering of flexible silicon chips onto polymer tapes

Journal of Micromechanics and Microengineering

Volumn 18, Issue 6, 2008, Pages

  Hungar, K ^a   Mokwa, W ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; FINITE ELEMENT METHOD; MICROSYSTEMS; POLYIMIDES; POLYMERS; SILICON; WELDING;

FINITE ELEMENT METHOD MODELS; FLEXIBLE MICROSYSTEMS; FLEXIBLE POLYIMIDES; NOVEL METHODS; POLYMER TAPES; SILICON CHIPS; ULTRATHIN SILICONS; VOLUME REDUCTIONS;

SOLDERING;

EID: 57349117070     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/6/064002     Document Type: Conference Paper

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