Embedding of chips for system in package realization - technology and applications

2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Volumn , Issue , 2008, Pages 383-386

  Boettcher, Lars ^a   Manessis, Dionysios ^b   Ostmann, Andreas ^a   Karaszkiewicz, Stefan ^b   Reichl, Herbert ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D PACKAGING; CHIP IN POLYMERS; DIE ASSEMBLIES; ELECTRICAL PERFORMANCE; ELECTRONIC SYSTEMS; EMBEDDED COMPONENTS; EUROPEAN PROJECTS; HIGH DENSITIES; HIGH-DENSITY PACKAGING; INDUSTRIAL ENVIRONMENTS; INTEGRATED MANUFACTURING; LARGE-AREA PROCESSING; LOW-COST SOLUTIONS; MECHANICAL ENVIRONMENTS; MULTIPLE LAYERS; NEW PROCESS; PRODUCTION PROCESS; SEMICONDUCTOR CHIPS; SYSTEM IN PACKAGES; TECHNOLOGICAL CAPABILITIES; TECHNOLOGICAL CHALLENGES;

CELLULAR RADIO SYSTEMS; MICROSYSTEMS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 64049109901     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2008.4783892     Document Type: Conference Paper

References (8)

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7. th European Microelectronics and Packaging Conference, Oulu, 2007
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