Embedding electronic circuits by laser direct-write

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2527-2533

  Pique A ^a   Mathews, S A ^b   Pratap, B ^a   Auyeung, R C Y ^a   Karns, B J ^a   Lakeou, S ^c  

^a NAVAL RESEARCH LABORATORY   (United States)

^b Catholic University of America ^*  (United States)

^c UNIVERSITY OF THE DISTRICT OF COLUMBIA   (United States)

Author keywords

Conducting pastes; Embedded bare die; Embedded electronics; Laser direct write; Laser printed interconnects

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; LASER APPLICATIONS; MICROPROCESSOR CHIPS;

CONDUCTING PASTES; EMBEDDED BARE DIE; EMBEDDED ELECTRONICS; LASER BASED DIRECT WRITE (LDW); LASER PRINTED INTERCONNECTS;

PRINTED CIRCUIT BOARDS;

EID: 33751200678     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.06.004     Document Type: Article

References (10)

1. In: Ulrich R., and Schaper L. (Eds). Integrated Passive Component Technology (2003), Wiley, Hoboken, NJ
2. In: Piqué A., and Chrisey D.B. (Eds). Direct-Write Technologies for Rapid Prototyping Applications (2002), Academic Press, San Diego, CA
3. Arnold C.B., Sutto T.E., Kim H., and Piqué A. Laser Focus World 5 (2004) S9
4. Piqué A., Arnold C.B., Wartena R.C., Pratap B., Shashishekar B., Swider-Lyons K.E., Weir D.W., and Kant R.A. RIKEN Rev. 50 (2003) 57
5. Piqué A., Arnold C.B., Kim H., Ollinger M., and Sutto T.E. Appl. Phys. A 79 (2004) 783
6. Piqué A., Arnold C.B., Pratap B., Auyeung R.C.Y., Kim H.S., and Weir D.W. SPIE Proc. 4977 (2003) 602
7. Kim H., Kushto G.P., Arnold C.B., Kafafi Z.H., and Piqué A. Appl. Phys. Lett. 85 (2004) 464
8. Piqué A., Mathews S.A., Auyeung R.C., Ollinger M., Kim H., Pratap B., Arnold C.B., and Sutto T.E. SPIE Proc. 5662 (2004) 564
9. Piqué A., Pratap B., Mathews S.A., Karns B.J., Auyeung R.C., Kasser M., Ollinger M., Kim H., Lakeou S., and Arnold C.B. SPIE Proc. 5713 (2005) 223
10. Kang S.K., Rai R.S., and Purushothaman S. IEEE Trans. Comp. Packag. Manuf. Technol. A 21 (1998) 18