Advanced substrate and packaging technology

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 19-24

  Ishida, T ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; CELLULAR TELEPHONES; COMPETITION; FLIP CHIP DEVICES; MICROELECTRONICS; MOBILE PHONES; OSCILLATORS (ELECTRONIC); PACKAGING; PRINTED CIRCUIT BOARDS; SUBSTRATES; TELEPHONE SETS;

BARE CHIP PACKAGING; BUILD-UP SUBSTRATES; BUSINESS OBJECTIVES; FLIP-CHIP PACKAGING; PACKAGING TECHNOLOGIES; SEMICONDUCTOR PACKAGING; SUBSTRATE STRUCTURE; TECHNOLOGY DEVELOPMENT;

CHIP SCALE PACKAGES;

EID: 0002712326     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704501     Document Type: Conference Paper

References (2)

1. Y. Bessho, Y. Tomura, Y. Hakotani, M. Tsukamoto, T. Ishida, K. Omoya, "A Stud-Bump-Bonding Technique for High Density Multi-Chip-Module" Proceedings of 1993 Japan EMT Symposium, pp.362-365, June 1993
2. T. Nishii, S. Nakamura, T. Takeoka and S. Nakatani, "Performance of Any Layer IVH structure Multi-layered Printed Wiring Board", Proceedings of 1995 Japan EMT Symposium, pp.93-96, December 1995