Processing benefits of high repetition rate and high average power 355 nm laser for micromachining of microelectronics packaging materials

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6459, Issue , 2007, Pages

  Patel, Rajesh S ^a   Bovatsek, James ^a  

^a Spectra Physics Lasers Division   (United States)

Author keywords

355 nm; Laser; Microelectronics; Micromachining; Mode locked; q switched

Indexed keywords

MATERIAL REMOVAL RATE; MICROELECTRONICS PACKAGING MATERIALS;

ELECTRONICS PACKAGING; LASER MODE LOCKING; MICROELECTRONICS; MICROMACHINING; POLYIMIDES; Q SWITCHED LASERS; THERMODYNAMIC PROPERTIES;

HIGH POWER LASERS;

EID: 34248678726     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.705589     Document Type: Conference Paper

References (3)

1. Mingwei Li, et.al., "A Comparison Study of Micromachining Using Mode-locked and Q-switched Diode Pumped Solids State Ultraviolate Laser," Proc.of ICALEO, LIA Publication, 2002.
2. Mingwei Li and Kevin Hartke, "Effect of Laser Parameters on Semiconductor Micromachining Using Diode-Pumped Solid-State Lasers," Proc.of ICALEO, LIA Publication, 2003.
3. Mingwei Li, et.al. "Micromachining of Liquid Crystal Polymer Film With Frequency Converted Diode-Pumped Nd-YVO4 Laser," Proc. of SPIE, Vol 4977, July 2003, pp 207-218.