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Volumn , Issue , 2009, Pages
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Advanced embedded active assemblies for extreme space applications
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Author keywords
[No Author keywords available]
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Indexed keywords
ADVANCED TECHNOLOGY;
EMBEDDED ACTIVE;
FLEXIBLE CIRCUIT;
FLEXIBLE MEMBRANES;
FLIP CHIP BONDING;
MOTOR CONTROL;
OPERATIONAL CHARACTERISTICS;
SILICON DIE;
SURFACE CONDITIONS;
THERMO-COMPRESSION;
AUTOMOBILE SEATS;
BANDPASS AMPLIFIERS;
DIES;
FLEXIBLE STRUCTURES;
LIQUID CRYSTALS;
METAL CLADDING;
OPERATIONAL AMPLIFIERS;
SPACE APPLICATIONS;
LIQUID CRYSTAL POLYMERS;
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EID: 70349111138
PISSN: 1095323X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/AERO.2009.4839527 Document Type: Conference Paper |
Times cited : (2)
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References (5)
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