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Volumn , Issue , 2009, Pages

Advanced embedded active assemblies for extreme space applications

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED TECHNOLOGY; EMBEDDED ACTIVE; FLEXIBLE CIRCUIT; FLEXIBLE MEMBRANES; FLIP CHIP BONDING; MOTOR CONTROL; OPERATIONAL CHARACTERISTICS; SILICON DIE; SURFACE CONDITIONS; THERMO-COMPRESSION;

EID: 70349111138     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.2009.4839527     Document Type: Conference Paper
Times cited : (2)

References (5)
  • 1
    • 0009759370 scopus 로고
    • Scattering-parameter measurement of microstrip devices
    • G.Gronau, "Scattering-parameter measurement of microstrip devices," Microwave Journal, 1992: p. 82-92.
    • (1992) Microwave Journal , pp. 82-92
    • Gronau, G.1
  • 4
    • 70349085265 scopus 로고    scopus 로고
    • Assembly of Thin, Flexible Electronics
    • to be submitted to IEEE Transactions on Advanced Packaging
    • Tan Zhang, Zhenwi Hou, R. Wayne Johnson, Alina Moussessian, and Linda Del Castillo, "Assembly of Thin, Flexible Electronics," to be submitted to IEEE Transactions on Advanced Packaging.
    • Zhang, T.1    Hou, Z.2    Wayne Johnson, R.3    Moussessian, A.4    Del Castillo, L.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.