3D embedding and interconnection of ultra thin (< 20 μm) silicon dies

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 222-226

  Iker, F ^a   Tezcan, D S ^a   Teixeira, R C ^a   Soussan, P ^a   De Moor, P ^a   Beyne, E ^a   Baert, K ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CONNECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; METALS; NONMETALS; OPTICAL DESIGN; SILICON; TECHNOLOGY;

ELECTRICAL CONNECTIONS; FABRICATION PROCESSES; METAL FILMS; PACKAGING TECHNOLOGIES; SILICON DIES; SINGULATION;

DIES;

EID: 50049088522     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469735     Document Type: Conference Paper

References (9)

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