Ultra-thin electronic device package

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 1, 2000, Pages 22-26

  Chen, Kevin Y ^a,b   Zenner, Robert L D ^a   Arneson, Michael ^b   Mountain, David ^b  

^a 3M COMPANY   (United States)

^b Microelectronics Research Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; RANDOM ACCESS STORAGE;

STATIC RANDOM ACCESS MEMORY (SRAM);

ELECTRONICS PACKAGING;

EID: 0033872812     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.826758     Document Type: Article

References (9)

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